Semiconductor Cooler With Narrowing Flow Paths
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Solution Overview
Problem
Current semiconductor cooling technologies face inefficiencies in effectively dissipating heat from semiconductor devices, particularly in power converters, where traditional cooling methods do not adequately address the thermal management needs of high-power components.
Innovation Solution
A cooler design featuring a cooling main body with a specific arrangement of flow paths and partitions that allows refrigerant to flow through a network of channels, enhancing heat transfer efficiency by creating a communication pathway between inflow and outflow paths and cooling flow paths, with nozzles positioned to impinge refrigerant directly on heat-generating components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional cooling methods are used for semiconductor devices, then the structure is simple, but the heat transfer efficiency is insufficient
Solution Approach 1:
The cooling device is divided into multiple flow paths (first cooling flow path, second cooling flow path, third cooling flow path) with partitions separating them. This segmentation allows refrigerant to flow through multiple channels, increasing the heat transfer area and efficiency while maintaining a relatively simple overall structure through modular design.
Solution Approach 2:
The patent introduces a third direction (perpendicular to the first and second directions) for the flow paths and partitions. This three-dimensional arrangement of cooling channels enables more efficient heat dissipation by utilizing spatial volume rather than just surface area, significantly improving heat transfer efficiency.
2Loss of energy
If refrigerant flow rate is increased to improve cooling, then the heat transfer coefficient increases, but the flow path design becomes more complex
Solution Approach 1:
The flow paths are segmented into multiple independent channels (first, second, and third cooling flow paths) separated by partitions. This allows the refrigerant to be distributed across multiple channels, increasing the overall heat transfer coefficient without requiring any single channel to be overly complex.
Solution Approach 2:
Multiple cooling flow paths are merged into a single cooling device structure, with all paths working together to cool the semiconductor device. The partitions merge the functionality of multiple channels while maintaining their individual flow characteristics, achieving high heat transfer efficiency through combined action.
3Loss of energy
If cooling flow paths are positioned between flow paths and cooling wall, then heat transfer efficiency improves, but device complexity increases
Solution Approach 1:
The cooling flow paths are positioned in a third direction between the flow paths and the cooling wall, creating a three-dimensional cooling structure. This spatial arrangement optimizes heat transfer by placing cooling channels in the most effective position for thermal coupling with the semiconductor device while maintaining structural organization through defined directions.
Solution Approach 2:
The cooling flow paths are locally positioned between the flow paths and cooling wall where heat transfer is most needed. This localized placement of cooling channels ensures optimal thermal management at the critical interface between the refrigerant and semiconductor device, improving cooling efficiency where it matters most.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves heat transfer efficiency, allowing for more effective cooling of semiconductor devices by increasing the flow rate of refrigerant and enhancing the heat transfer coefficient, thereby reducing thermal resistance and improving overall cooling performance.
Implementation Method 1
a cooling wall including a first face on which a heat generator is arranged, and a second face opposite to the first face
Implementation Method 2
a first flow path extending in a first direction and allowing refrigerant to flow in from one end thereof; a second flow path extending in the first direction and allowing the refrigerant to flow out from one end thereof
Data Source
AI summary
A cooler has a cooling main body portion that includes: a cooling wall in the Y direction including a first face with a heat generator thereon, and a second face opposite thereto; first and second flow path extending in the Y direction, the first flow path allowing refrigerant to flow in, and the second flow path allowing the refrigerant to flow out; cooling flow paths with a part of a wall surface comprising the second face; a partition spaced from the cooling wall in the Z direction, separating the first and the second flow paths from the cooling flow paths; and a first narrowing portion at a communication portion between a cooling flow path and the first flow path. The cooling flow paths are positioned between the first and flow paths and the cooling wall, and cause the first and the second flow path to communicate in the X direction.