Semiconductor Equipment Cooler with Heat Transfer Component for Noise Suppression
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Solution Overview
Problem
Semiconductor equipment faces challenges in achieving effective cooling and noise suppression, particularly due to the low heat resistance of current-smoothing capacitors and the influence of noise on control circuit boards.
Innovation Solution
The semiconductor equipment design includes a cooler directly contacting semiconductor modules and capacitors, with a busbar and heat transfer component configuration that enhances heat dissipation and noise isolation by positioning the heat transfer component between the busbar and control circuit board, utilizing a heat pipe for improved cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooler is provided for cooling semiconductor modules, then heat dissipation is improved, but the capacitor still suffers from low heat resistance and requires even higher cooling efficiency
Solution Approach 1:
The cooler is divided into separate cooling regions: a first cooling region that directly contacts semiconductor modules and a second cooling region that contacts the capacitor. This segmentation allows each component to receive tailored cooling based on its specific thermal requirements, with the capacitor receiving dedicated cooling attention to compensate for its low heat resistance.
Solution Approach 2:
Different portions of the cooler are designed with different thermal characteristics to match the local cooling needs of various components. The cooler provides enhanced cooling capacity specifically at the capacitor contact region, while maintaining standard cooling for semiconductor modules, thereby optimizing heat dissipation efficiency for each component's thermal requirements.
2Volume of moving object
If the capacitor is positioned close to semiconductor modules for compact design, then space is saved, but noise from the capacitor interferes with the control circuit board
Solution Approach 1:
A heat transfer component is introduced as an intermediary element positioned between the capacitor and the control circuit board. This component serves dual functions: it conducts heat away from the capacitor to the cooler while simultaneously providing electromagnetic shielding to block noise from the capacitor from reaching the control circuit board, thus resolving the noise interference problem while maintaining compact design.
Solution Approach 2:
The heat transfer component performs multiple functions simultaneously: thermal conduction to transfer heat from the capacitor to the cooler, and electromagnetic shielding to block noise interference. This multi-functionality allows the system to maintain compact dimensions while protecting the control circuit board from capacitor-generated noise.
3Temperature
If cooling efficiency is increased to address capacitor heat resistance, then thermal management is improved, but the system complexity increases
Solution Approach 1:
The cooler is designed as a unified structure that integrates multiple cooling functions into a single component. By combining the cooling of semiconductor modules and capacitors into one integrated cooler with strategically designed contact regions, the system achieves high cooling efficiency without proportionally increasing complexity, as the cooler performs multiple thermal management tasks simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves coolability and suppresses noise interference between the capacitor and control circuit board, ensuring better thermal management and operational performance of semiconductor equipment.
Implementation Method 1
a cooler (2) directly contacting the lower surface of each semiconductor module (3) and the lower surface of the capacitor (4)
Implementation Method 2
a heat transfer component (6) including a main body (62) having an upper surface and a lower surface, and being connected to the cooler (2)
Data Source
AI summary
Semiconductor equipment includes semiconductor modules sealed with a resin, each having first and second connection terminals exposed from the resin, a capacitor including third and fourth connection terminals, a cooler directly contacting the semiconductor modules and the capacitor, a busbar including a first busbar connecting the first connection terminal to the third connection terminal, a second busbar connecting the second connection terminal to the fourth connection terminal, and a first insulating layer sandwiched by the first and second busbars, main surfaces of the first and second busbars being parallel to each other, a control circuit board configured to control the semiconductor modules, and a heat transfer component including a main body connected to the cooler, and a second insulating layer arranged on the main body, the main body being in contact with the busbar and the control circuit via the second insulating layer.