Semiconductor Module Cooler Layout for Passive Element Cooling
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Solution Overview
Problem
Existing semiconductor devices face challenges in increasing cooling efficiency of passive elements without expanding the device size in the stacking direction, as the number of semiconductor modules increases, leading to larger device sizes and reduced cooling effectiveness.
Innovation Solution
A semiconductor device design featuring an elongated cooler with a refrigerant flow path, where semiconductor modules are arrayed in the longitudinal direction of the cooler, and the passive element is coupled to the cooler's opposing surface, allowing for enhanced cooling without increasing the device's size in the stacking direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the number of semiconductor modules increases in the stacked structure, then the cooling capacity is improved, but the device size in the stacking direction increases
Solution Approach 1:
The patent transitions from a vertical stacking arrangement to a horizontal array arrangement along the longitudinal direction of the cooler. Multiple semiconductor modules are positioned side-by-side along the length of the cooler rather than stacking vertically, which allows increased cooling capacity without increasing the stacking direction dimension. The cooler's longitudinal dimension is extended to accommodate multiple modules in parallel.
2Productivity
If semiconductor modules and passive elements are stacked in gaps between cooling pipes, then space utilization is improved, but the device size increases in the stacking direction
Solution Approach 1:
The patent arranges semiconductor modules and passive elements in gaps between cooling pipes along the longitudinal direction of the cooler, utilizing the horizontal space rather than stacking vertically. This allows multiple components to be positioned in parallel along the length of the cooler, maintaining high space utilization while avoiding increases in the stacking direction dimension.
Solution Approach 2:
The cooler is divided into multiple sections with cooling pipes arranged in a specific pattern, creating gaps that can accommodate semiconductor modules and passive elements. This segmentation allows for efficient packing of components within the available horizontal space without requiring vertical stacking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency of both semiconductor modules and passive elements, reducing the overall device size and simplifying the configuration by allowing the cooler to effectively cool both components without gaps, thereby improving thermal management.
Implementation Method 1
the plurality of semiconductor modules is coupled to, or is in contact with, the first cooling surface, and the passive element is coupled to, or is in contact with, the second cooling surface
Implementation Method 2
an elongated cooler through which a refrigerant flows
Data Source
AI summary
A semiconductor device includes an elongated cooler through which a refrigerant flows; a plurality of semiconductor modules, each including one or more semiconductor elements; and a passive element configured to drive the plurality of semiconductor modules, the cooler includes a first cooling surface; and a second cooling surface opposing the first cooling surface, the plurality of semiconductor modules is arrayed in a longitudinal direction of the cooler and is coupled to, or is in contact with, the first cooling surface, and the passive element is coupled to, or is in contact with, the second cooling surface.