Semiconductor Cooler With Segmented Wall Through-Holes
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Solution Overview
Problem
Conventional cooler designs for semiconductor modules face challenges in maintaining refrigerant flow paths during securing to a base, leading to potential hot spots and reduced cooling efficiency due to obstructed installation of cooling fins or partition walls by securing members.
Innovation Solution
The cooler design incorporates a refrigerant flow path surrounded by a first wall part with a through-hole, a second wall part with a connection region and a side wall part, allowing for secure attachment to a base while maintaining refrigerant flow, using a securing member that passes through a second through-hole and a seal member to prevent protrusion into the flow path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional securing methods using bolts or screws passing through the cooler body are employed, then the cooler can be securely attached to the base, but the refrigerant flow path is obstructed and cooling efficiency deteriorates
Solution Approach 1:
The cooler body is divided into multiple wall parts (first wall part, second wall part, side wall part) with separate through-holes positioned strategically. The first through-hole is for refrigerant flow while the second through-hole is for securing members, separating the cooling function from the securing function to eliminate flow path obstruction.
Solution Approach 2:
Different regions of the cooler body are assigned different functions: the first wall part region allows refrigerant flow, while the second wall part region accommodates securing members. This local differentiation ensures that securing members do not obstruct the refrigerant flow path while maintaining secure attachment.
2Reliability
If cooling fins or partition walls are installed in the cooler body, then cooling efficiency is improved, but the locations where securing members pass through obstruct their installation
Solution Approach 1:
The cooler body is segmented into multiple wall parts with dedicated through-holes. This segmentation allows cooling fins and partition walls to be installed in regions not occupied by securing members, enabling optimal cooling structure arrangement without obstruction.
3Volume of moving object
If the cooler size is reduced for compactness, then space conservation is improved, but it becomes difficult to maintain both refrigerant flow paths and securing structures
Solution Approach 1:
The first through-hole for refrigerant flow and the second through-hole for securing members are integrated into the same cooler body structure. This merging allows compact design while maintaining both functions, as the through-holes are positioned to serve dual purposes without interfering with each other.
Solution Approach 2:
The design utilizes spatial arrangement in three dimensions by positioning through-holes at different locations and orientations on the cooler body. This dimensional arrangement allows compact packaging while maintaining adequate space for both refrigerant flow and securing structures.
Data Source
AI summary
A cooler for cooling a semiconductor module to be secured to a base, the cooler including: a cooler body that includes a refrigerant flow path surrounded by a first wall part having a first through-hole, a second wall part that is arranged facing the first wall part and that includes a connection region which is to be connected to the base at a position opposing the first through-hole, and a side wall part for connecting the periphery of the first wall part and the periphery of the second wall part; and a lid for closing off the first through-hole.