Semiconductor Module Cooler with Variable Fin Contact for Uniform Cooling
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Solution Overview
Problem
Existing coolers face challenges in maintaining uniform temperature distribution of heating elements along the refrigerant flow path, leading to inefficiencies due to varying refrigerant temperatures from inlet to outlet.
Innovation Solution
The cooler design includes a top plate, bottom plate, and fins arranged such that the fin density and contact area with the top plate vary along the refrigerant flow path, ensuring uniform temperature distribution by adjusting the contact state of the fins with the top plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the density of fins is gradually increased from inlet to outlet, then cooling efficiency is improved, but temperature uniformity of heating element deteriorates
Solution Approach 1:
The fin contact area with the top plate is made non-uniform along the flow path, with smaller contact areas in the upstream section and larger contact areas in the downstream section. This local variation in heat transfer characteristics compensates for the temperature gradient of the refrigerant, achieving uniform heating element temperature while maintaining high cooling efficiency throughout the flow path.
2Temperature
If fin density is increased, then heat transfer performance is improved, but manufacturing complexity increases
Solution Approach 1:
Instead of changing fin density, the invention changes the contact area parameter between fins and top plate. This is achieved by varying the thickness of the top plate or the dimensions of fin contact surfaces, which are easier to manufacture than dense fin structures. The parameter change maintains heat transfer performance while reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves uniform temperature distribution among heating elements, enhancing cooling efficiency and reducing operational variations across the flow path.
Implementation Method 1
a contact area between the fin and the top plate in the first section is smaller than a contact area between the fin and the top plate in the second section
Implementation Method 2
a plurality of fins arranged between a first surface of the top plate and a second surface of the bottom plate in a flow path of a refrigerant
Data Source
AI summary
A cooler having a flow path, including a first section and a second section downstream to the first section, for a refrigerant. The cooler includes: a top plate having a first surface and a second surface opposite to each other; a bottom plate having a first surface and a second surface opposite to each other, the second surface facing the first surface of the top plate; a plurality of fins arranged between the first surface of the top plate and the second surface of the bottom plate; and a frame provided between the top plate and the bottom plate, and having a wall surface surrounding the plurality of fins. An arrangement density of the fins is the same in the first and second sections. A contact area between each of the fins and the top plate in the first section is smaller than that in the second section.