Semiconductor Cooling Cover With 3D Pins for Better Heat Transfer
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Solution Overview
Problem
Conventional connecting part pins with a linear structure in semiconductor cooling systems limit the heat conductivity and radiation effects, necessitating the development of pins with various forms to enhance these properties.
Innovation Solution
Separately manufactured connecting part pins with linear or non-linear structures are arranged within a cover body, featuring insertion grooves and a coolant flow path to increase the contact area with the coolant, allowing for improved heat radiation and conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If connecting part pins are formed as one body with substrate using conventional manufacturing process, then manufacturing process is simple, but heat conductivity effect and heat radiation effect are limited due to linear structure
Solution Approach 1:
The connecting part pin is divided into multiple separate components: a pin body and a heat dissipation fin portion, which are manufactured separately and then assembled. This segmentation allows the heat dissipation fin portion to be optimized for thermal performance while the pin body maintains structural integrity, resolving the contradiction between manufacturing simplicity and heat conductivity.
Solution Approach 2:
The connecting part pin transitions from a one-dimensional linear structure to a three-dimensional structure with heat dissipation fins extending in multiple directions. This dimensional expansion significantly increases the surface area for heat radiation while maintaining a relatively simple manufacturing process through separate component fabrication and assembly.
2Ease of manufacture
If connecting part pins have linear structure, then manufacturing is conventional and simple, but heat radiation effect is insufficient
Solution Approach 1:
The connecting part pin is segmented into a pin body and a heat dissipation fin portion with extended surfaces. This segmentation enables the creation of a larger heat exchange surface area through the fin structure while maintaining conventional manufacturing methods for each separate component.
Solution Approach 2:
The heat dissipation fin portion features a porous or lattice-like internal structure that increases the surface area for coolant contact without significantly increasing the overall volume or complicating the manufacturing process. This porous structure allows efficient heat transfer while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances thermal stability of semiconductor components by enlarging the coolant contact area, efficiently transferring heat from the components to the coolant, thereby improving heat radiation and conductivity effects.
Implementation Method 1
heat transmitted from the semiconductor components to the connecting part pins is cooled by the coolant
Implementation Method 2
enlarge an area contacting a coolant and thereby, to improve heat radiation effect and heat conductivity effect
Data Source
AI summary
Provided is a system for cooling semiconductor components including: a cover body including at least one upper cover and lower cover, which are separated from each other, face each other, and are combined to form a coolant flow path in an inner space thereof; an inlet combined to one side of the cover body and used for a coolant to flow in; an outlet combined to the other side of the cover body and used for the coolant to be discharged; at least one connecting part pin inserted and arranged toward a flowing direction of the coolant in the inner space of the cover body; and insertion grooves formed for the connecting part pins to be inserted in the inner space of the cover body, wherein the upper cover or the lower cover of the cover body is combined to at least one of the upper surfaces or the lower surfaces of semiconductor components by using connecting members so that heat transmitted from the semiconductor components to the connecting part pins is efficiently radiated by enlarging an area contacting the coolant.