Semiconductor Cooling Baffle Layout for Targeted Heatsink Heat Removal
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Solution Overview
Problem
Current cooling technologies for semiconductor devices, particularly in power inverters and high-power semiconducting switch devices, are inadequate in terms of heat removal efficiency, leading to limitations in power density and maximum power handling due to poor heat spreading and increased joule heating losses.
Innovation Solution
A semiconductor cooling arrangement featuring semiconductor assemblies with heatsinks, encapsulants, and baffles, where the semiconductor die is directly bonded to the heatsink, and a coolant channel is integrated to enhance heat dissipation through optimized fluid flow and thermal conductivity, reducing system-wide inductance and joule heating losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heatsink is enlarged to improve thermal capacity, then heat dissipation efficiency is improved, but weight and volume of the power supply module increase
Solution Approach 1:
The heatsink incorporates localized high thermal conductivity regions (such as copper or aluminum heat spreaders) in areas of highest heat generation, while using lower conductivity materials in less critical areas. This creates a gradient of thermal properties that optimizes heat dissipation where needed most without requiring uniform enlargement of the entire heatsink structure.
Solution Approach 2:
The heatsink is constructed as a composite structure combining materials with different thermal conductivities - typically a base material (such as aluminum) with embedded high-conductivity pathways (such as copper heat pipes or thermal vias). This composite approach achieves superior thermal capacity in a compact, lightweight configuration by leveraging the complementary properties of different materials.
2Temperature
If the heatsink is enlarged to improve thermal capacity, then heat dissipation efficiency is improved, but volume of the power supply module increases
Solution Approach 1:
The heatsink utilizes vertical heat dissipation pathways through heat pipes, vapor chambers, or thermally conductive adhesives that transfer heat from the semiconductor device through the encapsulant and into the heatsink in the vertical dimension. This three-dimensional heat transfer approach increases thermal capacity without proportionally increasing the horizontal footprint of the module.
Solution Approach 2:
High thermal conductivity materials and structures are concentrated in the immediate vicinity of the semiconductor device and along the primary heat flow paths, while peripheral areas of the heatsink use lighter, lower-conductivity materials. This localized optimization provides maximum thermal capacity in the critical regions without requiring uniform material distribution throughout the entire heatsink volume.
3Loss of energy
If conventional cooling arrangements are used, then heat removal is provided, but heat spreading is poor and joule heating losses increase
Solution Approach 1:
A thermally conductive encapsulant material serves as an intermediary between the semiconductor device and the heatsink, providing both electrical insulation and thermal conduction pathways. This encapsulant with optimized thermal conductivity (such as epoxy compounds filled with aluminum oxide, boron nitride, or other thermally conductive particles) efficiently spreads heat laterally while maintaining electrical isolation, reducing hot spots and joule heating losses.
Solution Approach 2:
The encapsulant is formulated as a composite material combining an epoxy matrix with high thermal conductivity fillers (such as aluminum oxide, boron nitride, or silicon carbide particles). This composite structure provides both the electrical insulation required for safety and the thermal conduction necessary for effective heat spreading, thereby reducing joule heating losses without compromising electrical isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly improves heat removal efficiency, increasing power density and maximum power handling while minimizing joule heating losses, thus addressing the limitations of existing cooling technologies.
Implementation Method 1
heatsinks absorb and dissipate heat from electrical components by thermal contact
Implementation Method 2
fluid flows through the through-holes to a region of a respective semiconductor assembly
Data Source
AI summary
The semiconductor cooling arrangement comprises one or more semiconductor assemblies, a housing, and one or more baffles. Each semiconductor assembly comprises a heatsink, a semiconductor die, an encapsulant, and electrical connections. The semiconductor die is bonded to the heatsink and contains a semiconductor power device. The encapsulant covers the semiconductor die. The side of the heatsink to which the semiconductor die is bonded extends beyond the encapsulant. The electrical connections pass through the encapsulant and to the semiconductor die. The housing has a chamber for housing the one or more assemblies. Each baffle comprises through-holes arranged such that fluid flows through the through-holes to a region of a respective semiconductor assembly to which the semiconductor power device is mounted, or to a region of the heatsink of the semiconductor assembly opposite a location to which the semiconductor power device is mounted.