Power Semiconductor Cooling Chamber With Bypass Flow Balancing
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Solution Overview
Problem
In power semiconductor modules, the cooling inefficiency leads to uneven temperature distribution and overcooling, particularly affecting the last module in a serial configuration, which reduces reliability and requires more chips for achieving a certain power rating.
Innovation Solution
A power semiconductor component with a cooling chamber design that includes flow resistance regions and bypass regions, allowing for uniform cooling and reduced flow resistance, enhancing the cooling efficiency and preventing overcooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If power semiconductor modules are cooled in a serial configuration, then the cooling structure is simplified, but the temperature distribution becomes uneven and the last module is insufficiently cooled
Solution Approach 1:
The patent applies local quality by creating different flow resistance characteristics at different locations within the cooling chamber. Flow resistance elements are strategically positioned to create higher resistance near the inlet and lower resistance toward the outlet, matching the local cooling needs of each module position. This localized adjustment of flow properties ensures uniform temperature distribution without requiring complex external control systems.
2Device complexity
If power semiconductor modules are cooled in a serial configuration, then the cooling structure is simplified, but the first module becomes overcooled
Solution Approach 1:
The patent implements local quality by positioning flow resistance elements to create location-specific flow characteristics. The first module region incorporates higher flow resistance to reduce excessive coolant flow and prevent overcooling, while downstream modules have progressively lower resistance. This localized flow resistance adjustment optimizes cooling efficiency and prevents energy waste from overcooling the first module.
3Temperature
If the coolant flow rate is increased to cool the last module, then the last module cooling improves, but the first module becomes overcooled and energy is wasted
Solution Approach 1:
The patent applies parameter changes by modifying the flow resistance parameter along the coolant flow path. Instead of uniformly increasing flow rate throughout the system, the invention changes the local flow resistance parameter to create a gradient that distributes coolant flow appropriately. This results in improved cooling at the last module while preventing overcooling and energy waste at the first module.
4Power
If more power semiconductor modules are used to achieve higher power, then the power rating increases, but the temperature distribution uniformity deteriorates
Solution Approach 1:
The patent addresses this contradiction by implementing local quality through position-dependent flow resistance elements. As more modules are added to increase power rating, the flow resistance elements are strategically positioned to ensure each module receives appropriate coolant flow. This localized flow management maintains temperature distribution uniformity even as the system scales to higher power ratings with multiple modules.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves more uniform temperature distribution across modules, increases current rating without design modifications, and extends the component's lifetime with improved reliability.
Implementation Method 1
The cooling structures are configured, exemplarily, to cool the power semiconductor modules during operation
Implementation Method 2
The cooling chamber is adapted for a flow direction of a coolant substance within the cooling chamber from the inlet port to the outlet port
Data Source
AI summary
A power semiconductor component with power semiconductor modules connected to a cooling structure, and a cooling chamber having an inlet and outlet port, and adapted for a flow direction of a coolant substance from the inlet port to the outlet port, each of the cooling structures provided within the cooling chamber consecutively in the flow direction forming a flow resistance region in the cooling chamber, the cooling chamber comprises a bypass region connected in parallel to at least one of the flow resistance regions being closer to the inlet port, and is adapted for a flow rate of the at least one flow resistance region, which is connected in parallel to the bypass region, closer to the inlet port being smaller than a flow rate of one of the at least two flow resistance regions closer to the outlet port.