Semiconductor Substrate Cooling Cavity for Heat Dissipation
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Solution Overview
Problem
Electronic devices generate heat during operation, which affects their performance, and existing heat dissipation methods are inadequate.
Innovation Solution
A semiconductor device design featuring a substrate with a heat dissipation component having a cavity, inlet, and outlet, along with a thermal interface material and adhesive layer, to dissipate heat using a fluid flow through the cavity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation methods are used, then device structure remains simple, but heat dissipation efficiency is insufficient
Solution Approach 1:
The heat dissipation component is nested within the substrate structure, forming an integrated assembly where the heat dissipation component is positioned in the substrate and extends beyond its surface. This nesting approach allows the heat dissipation function to be embedded within the device structure without requiring separate external heat dissipation devices, thereby improving heat dissipation efficiency while controlling structural complexity.
Solution Approach 2:
The patent combines the substrate and heat dissipation component into a single integrated structure where the heat dissipation component is formed as part of the substrate assembly. This merging of functions allows the substrate to simultaneously serve as both a mounting platform and a heat dissipation structure, improving thermal management while simplifying the overall device architecture.
2Temperature
If heat dissipation component is added to substrate, then heat dissipation efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The heat dissipation component is formed as part of the substrate during the substrate manufacturing process itself, rather than being added as a separate post-processing step. This preliminary action approach integrates the heat dissipation structure formation into the existing substrate fabrication workflow, thereby improving heat dissipation efficiency while minimizing additional manufacturing complexity.
3Temperature
If semiconductor component is placed between substrate and heat dissipation component, then heat dissipation performance improves, but device assembly complexity increases
Solution Approach 1:
The substrate serves multiple functions simultaneously: it acts as a mounting platform for semiconductor components, provides structural support, and functions as a heat dissipation structure through the integrated heat dissipation component. This multi-functionality allows the semiconductor component to be mounted on the substrate in a conventional manner while still achieving improved heat dissipation performance, thereby minimizing additional assembly complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates heat from semiconductor components, improving device performance by enhancing heat transfer and dissipation efficiency.
Implementation Method 1
the heat dissipation component may dissipate heat from the semiconductor component through convection
Implementation Method 2
a thermal interface material and an adhesive layer, to dissipate heat using a fluid flow through the cavity
Data Source
AI summary
A semiconductor device includes a substrate, a semiconductor component and a heat dissipation component. The semiconductor component is disposed on the substrate. The heat dissipation component is disposed on the substrate and having a cavity, an inlet and an outlet, wherein the inlet and the outlet communicate with the cavity.