Semiconductor Cooling Base Body With Compressed Closed Channels
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing cooling devices for semiconductor arrangements are complex and costly, necessitating more effective and cost-efficient methods for heat dissipation as power density increases in power converters.
Innovation Solution
A method involving the manufacturing of a cooling device with a base body having continuous channels sealed by compression to form a closed channel structure, filled with a heat transfer fluid, utilizing a metallic base body with extruded channels and grooves for efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If complex cooling device structures are used to improve heat dissipation effectiveness, then heat dissipation performance is improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The cooling device is segmented into distinct functional zones: a base body with channels for heat transfer fluid, contact grooves for semiconductor element placement, and connecting grooves for electrical connections. This segmentation allows each zone to be optimized independently while simplifying the overall manufacturing process through standardized production of the base body structure.
Solution Approach 2:
The invention changes the physical state and distribution of the heat transfer fluid within the base body channels, utilizing phase change or fluid dynamics parameters to enhance heat dissipation. By optimizing fluid flow parameters and channel geometry, effective cooling is achieved without requiring complex external cooling systems.
2Reliability
If effective heat dissipation concepts are implemented to prevent thermal overload, then reliability is improved, but manufacturing cost increases
Solution Approach 1:
The invention merges multiple functions into the base body structure: cooling channels, contact surfaces for semiconductor elements, and connecting pathways are integrated into a single monolithic component. This consolidation eliminates the need for separate manufacturing and assembly steps for multiple parts, significantly reducing manufacturing cost while maintaining reliable heat dissipation and electrical connection functions.
Solution Approach 2:
The base body serves multiple functions simultaneously: it provides structural support, conducts heat away from semiconductor elements through integrated channels, establishes electrical connections via connecting grooves, and facilitates fluid flow. This multi-functionality reduces the number of components needed and simplifies the overall device architecture, lowering manufacturing costs while ensuring reliable operation.
3Volume of moving object
If power density is increased through miniaturization, then device compactness is improved, but heat dissipation challenges increase
Solution Approach 1:
The cooling channels are nested within the base body structure, with the heat transfer fluid pathway embedded inside the solid material. This nesting approach maximizes the use of internal volume for cooling functions without increasing the external dimensions of the device, enabling compact design while maintaining effective heat dissipation capacity.
Solution Approach 2:
The invention transitions from surface-level cooling to three-dimensional heat dissipation by incorporating channels that extend through the volume of the base body. This volumetric approach to cooling allows heat to be dissipated from multiple directions and depths, effectively managing thermal loads in compact, miniaturized devices where surface area is limited.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method simplifies and reduces the cost of manufacturing a cooling device, enabling effective heat dissipation through a reliable, cost-effective closed channel structure, suitable for use as a heat pipe or vapor chamber.
Implementation Method 1
the base body is in direct contact with the heat transfer fluid
Implementation Method 2
the channels are closed by compression to form a closed channel structure
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The invention relates to a method for manufacturing a cooling device (24) for a semiconductor arrangement (54). To enable simpler and more cost-effective manufacturing, the following steps are proposed: Manufacturing (A) a base body (2), in particular a metallic one, with a flat surface (4), a first side surface (6), and a second side surface (8) arranged opposite the first side surface (6), wherein continuous channels (10) extending from the first side surface (6) to the second side surface (8) and parallel to the surface (4) are introduced into the base body (2), wherein adjacent channels (10) are each connected via a web (20); introducing (B) contact grooves (16) and connecting grooves (18) on both sides, the connecting grooves (18) being arranged between adjacent channels (10) by partially removing the web (20) arranged between the adjacent channels (10).wherein the channels (10) are arranged between the surface (4) and the contacting grooves (16) and the connecting grooves (18) extend deeper into the base body (2) than the respective contacting grooves (16), closing (C) the channels (10) by compression to form a closed channel structure (22), filling (D) the channel structure (22) with a heat transfer fluid (48) so that the base body (2) is in direct contact with the heat transfer fluid (48).