Semiconductor Cooling Apparatus with Constricted Flow Passages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional cooling apparatuses for semiconductor modules face challenges in efficiently cooling multiple semiconductor chips due to uneven coolant distribution and pressure loss issues, leading to reduced cooling efficiency and increased costs for coolant circulation systems.
Innovation Solution
The proposed cooling apparatus features a ceiling plate and case portion with strategically arranged constricted passages and open portions, which guide coolant flow to improve pressure distribution and enhance cooling efficiency by ensuring uniform coolant distribution across multiple semiconductor chips, reducing the complexity and size of the coolant circulation system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cooling apparatus structures are used, then the cooling system can be implemented, but uneven coolant distribution and pressure loss occur leading to reduced cooling efficiency
Solution Approach 1:
The side wall includes constricted portions that locally change the width of the flow portion, creating varying flow resistance in different regions. This local structural modification directs coolant flow to areas needing more cooling while maintaining overall system simplicity
Solution Approach 2:
The flow portion is segmented into multiple passages with different characteristics (first passage with lower pressure loss, second passage with greater pressure loss). This segmentation allows differential coolant distribution to multiple semiconductor chips without requiring a complex external circulation system
2Ease of manufacture
If the coolant circulation system is simplified to reduce costs, then manufacturing costs decrease, but coolant distribution uniformity and pressure control deteriorate
Solution Approach 1:
The cooling apparatus integrates the flow portion directly into the case portion, merging the coolant distribution function with the structural housing. This eliminates the need for separate complex circulation systems while maintaining precise coolant distribution through the constricted portions in the side wall
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the cooling efficiency of semiconductor modules by ensuring uniform coolant distribution and reducing the complexity and size of the coolant circulation system, thereby enhancing the electric conversion capability and reducing costs.
Implementation Method 1
a first constricted portion that changes a width of the flow portion in a first direction parallel to one of the sets of edges opposing each other in an overhead view, along a second direction orthogonal to the first direction
Implementation Method 2
a cooling fin arranged in the flow portion
Implementation Method 3
allows coolant to flow therethrough
Data Source
AI summary
Provided is a cooling apparatus for a semiconductor module including a semiconductor chip, the apparatus including a ceiling plate having a bottom surface; and a case portion having two sets of opposing edges in an overhead view, and including a flow portion arranged on the plate's bottom surface side and allowing coolant to flow therethrough, an outer edge portion surrounding the flow portion, and a side wall provided on the outer edge portion's inner side, the side wall including a first constricted portion changing the flow portion's width in a first direction parallel to one of the edge sets, along a second direction orthogonal to the first direction, a fastening portion for fastening the plate and the case portion to an external apparatus provided where the plate and the outer edge portion are overlapped and arranged, and the fastening portion arranged opposite the first constricted portion in the first direction.