Semiconductor Cooling Case With Diffusion Wall For Uniform Flow
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Solution Overview
Problem
Existing semiconductor cooling devices face challenges in achieving uniform heat radiation and efficient cooling due to non-uniform flow rates of the cooling medium, which affects the performance of semiconductor modules, especially as they miniaturize and increase in power, and also restrict the placement of electronic components like film capacitors on the bottom surface.
Innovation Solution
The semiconductor device features a cooling system with an introducing port and discharge port positioned off-center on the side walls of the cooling case, incorporating a diffusion wall to enhance lateral flow and reduce pressure loss, allowing for increased heat radiation ability and enabling the attachment of electronic components on the bottom surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the inlet and outlet for cooling medium are provided at the bottom surface of the cooling device, then the structure is simple, but electronic components cannot be attached to the bottom surface
Solution Approach 1:
The patent moves the inlet and outlet ports from the bottom surface (2D plane) to the side surface (3D spatial relocation), enabling electronic components to be mounted on the bottom surface while maintaining cooling functionality. This dimensional change in port placement resolves the conflict between structural simplicity and component placement flexibility.
2Productivity
If the cooling medium flow rate is increased to enhance cooling efficiency, then heat radiation ability improves, but pressure loss increases
Solution Approach 1:
The patent introduces curved guide walls with rounded corners in the cooling medium flow path, replacing sharp angular transitions. This curvature design reduces flow separation and turbulence, allowing higher flow rates for improved cooling efficiency while minimizing the associated pressure loss.
Solution Approach 2:
The patent optimizes the flow path geometry parameters, including the curvature radius of guide walls and the angle of flow direction changes. By carefully controlling these parameters, the system achieves high cooling efficiency through increased flow rate while keeping pressure loss within acceptable limits.
3Productivity
If fins are arranged densely to increase heat radiation surface area, then heat radiation ability improves, but flow path space is reduced
Solution Approach 1:
The patent divides the cooling device into distinct functional zones: a fin array region for heat radiation and a separate flow path region for cooling medium circulation. This segmentation allows dense fin arrangement for high heat radiation ability while maintaining sufficient flow path space through spatial separation of functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures uniform cooling medium flow, enhances heat radiation performance, and allows for the placement of electronic components on the bottom surface, addressing the limitations of previous designs by achieving high heat radiation ability with reduced pressure loss and improved cooling uniformity.
Implementation Method 1
The cooling medium (for example, water or a long-life coolant) pressurized by an external pump is introduced from the introducing port and flows through the flow path inside the cooling case. As a result, the thermal energy generated by the power semiconductor elements is released through the fins to the cooling medium.
Implementation Method 2
The cooling medium is discharged from the discharge port, cooled in an external heat exchanger, pressurized by the pump, and then returned into the flow path inside the cooling case.
Data Source
Figure 1(a)~1(c)
Figure 2(a)~2(c)
Figure 3~4
AI summary
A semiconductor device (1) includes an insulating substrate (14); a semiconductor element (12) carried on the insulating substrate (14); and a cooling device (20) that cools the semiconductor element (12). The cooling device (20) includes a heat radiation substrate (21) joined to the insulating substrate (14); an assembly of a plurality of fins(22) provided on a surface of the heat radiation substrate (21) on a side opposite that of a surface joined to the insulating substrate (14); and a cooling case (23) of a box-like shape that accommodates the fins (22) and has a bottom wall (23a) and side walls (23b). An introducing port (23c) and a discharge port (23d) for a cooling medium are provided in a pair of a first side wall (23b1) and a second side wall (23b2) of the cooling case (23). A diffusion wall causing the cooling medium introduced from the introducing port (23c) to diffuse along the first side wall (23b1) is provided between the first side wall (23b1), in which the introducing port (23c) is provided, and the bottom wall (23a), where the diffusion wall is an ascending inclined surface formed from a bottom side of the first side wall (23b1) toward the bottom wall (23a).