Semiconductor Cooling Duct with Dual-Resin Metal Case Sealing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing air cooling systems for semiconductor modules are prone to overheating, which can cause the metal case to melt, forming holes and allowing foreign matter to enter, compromising the system's integrity.
Innovation Solution
A cooling system design featuring a resin duct with a thermoplastic and thermosetting resin combination, where the thermoplastic resin melts to cover holes formed in the metal case during overheating, while the thermosetting resin maintains its structure, preventing foreign matter ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling is used for semiconductor modules, then cooling effectiveness is improved, but the risk of overheating and metal case melting increases
Solution Approach 1:
The resin duct is pre-installed to cover the metal case upper surface before overheating occurs. When overheating happens, the thermoplastic resin portion is already in position to melt and flow into holes, providing immediate protection without requiring active response from the system.
Solution Approach 2:
The harmful heat from overheating that would normally melt the metal case is converted into a beneficial effect by causing the thermoplastic resin to melt. This melted resin flows into holes formed in the metal case, sealing them and preventing foreign matter entry. The harm (excessive heat) is thus transformed into a protective action.
2Ease of manufacture
If a single resin material is used in the duct, then manufacturing simplicity is improved, but the ability to cover holes while maintaining duct structure deteriorates
Solution Approach 1:
The resin duct is segmented into two functional portions: a thermoplastic resin portion that melts to cover holes, and a thermosetting resin portion that maintains structural integrity. This segmentation allows each material to perform its specific function optimally without compromising the other.
Solution Approach 2:
The duct uses a composite structure combining thermoplastic and thermosetting resins. The thermoplastic resin provides the hole-covering function through melting, while the thermosetting resin provides structural support that remains intact. This composite material approach enables both hole sealing and structural maintenance simultaneously.
3Object-affected harmful factors
If the resin duct covers the entire upper surface, then foreign matter protection is improved, but cooling air flow deteriorates
Solution Approach 1:
The resin duct is designed to cover only the necessary portions of the metal case upper surface where holes are most likely to form, rather than covering the entire surface. This localized coverage maintains adequate cooling air flow paths while providing protection where it is most needed.
Solution Approach 2:
The duct provides partial coverage of the upper surface, which is sufficient to protect against foreign matter entry through holes while leaving enough exposed area for adequate cooling air circulation. The coverage is optimized to be just enough to protect against the specific hazard without excessive coverage that would impede cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively covers holes in the metal case due to overheating, reducing the entry of foreign matter and maintaining system integrity by using a resin duct with a thermoplastic and thermosetting resin combination.
Implementation Method 1
the first resin portion of the resin duct that is made of a thermoplastic resin is melted by the gas flowing out of the metal case through the hole
Implementation Method 2
a blower; a resin duct disposed so as to cover at least part of an upper surface of the upper wall of the metal case, and configured to guide cooling air from the blower along the upper surface of the upper wall
Data Source
AI summary
A cooling system includes: a blower; a metal case; a semiconductor module housed in the metal case and disposed on a lower surface of an upper wall of the metal case; and a resin duct disposed so as to cover at least part of an upper surface of the upper wall of the metal case, and configured to guide cooling air from the blower along the upper surface of the upper wall between an upstream end of the resin duct that is connected to the blower and a downstream end of the resin duct that is open to outside. The resin duct includes a first resin portion made of a thermoplastic resin, and a second resin portion made of a thermosetting resin. The second resin portion of the resin duct is located above the semiconductor module and is supported by the first resin portion.