Semiconductor Cooling Fin Integration for Weight Reduction
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Solution Overview
Problem
Conventional methods of fixing semiconductor packages to cooling devices using screws increase the number of components and weight, while attempts to join without screws fail to balance heat conductivity and strength.
Innovation Solution
A semiconductor device design where a cooling body projects from a resin encapsulating the semiconductor element, inserted into a cooler with a joining material securing the resin and cooler surfaces, separating the cooling and joint portions to ensure compatibility and reduce components and weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If screws or similar fasteners are used to fix the semiconductor package to the cooling device, then the strength of joining is improved, but the number of component parts and overall weight increase
Solution Approach 1:
The cooling body is integrated directly into the semiconductor package structure, eliminating the need for separate fasteners. The cooling body serves dual purposes: it provides thermal management and acts as the joining element itself, merging the cooling function with the mechanical attachment function.
Solution Approach 2:
A joining material is introduced as an intermediary substance between the cooling body and the substrate to achieve strong bonding without mechanical fasteners. The joining material fills the interface gap and provides both thermal conductivity and mechanical strength.
2Strength
If screws or similar fasteners are used to fix the semiconductor package to the cooling device, then the strength of joining is improved, but the overall weight increases
Solution Approach 1:
The cooling body is integrated directly into the semiconductor package structure, eliminating the need for separate fasteners. The cooling body serves dual purposes: it provides thermal management and acts as the joining element itself, merging the cooling function with the mechanical attachment function.
Solution Approach 2:
The mechanical fastening system (screws, clips, or other mechanical fasteners) is replaced with a chemical bonding system using joining material. This substitution eliminates the weight of mechanical fasteners while maintaining or improving the strength of the joint.
3Device complexity
If the cooling body is integrated directly with the joining area, then the number of component parts is reduced, but compatibility between heat conductivity and strength of joining cannot be ensured
Solution Approach 1:
The cooling body is designed with differentiated local properties: the portion contacting the semiconductor element is optimized for heat conduction, while the portion extending to the joining area is optimized for mechanical strength and bonding compatibility. This local differentiation allows each region to perform its specific function effectively.
Solution Approach 2:
The cooling body may be constructed from composite materials or material combinations that provide both high thermal conductivity and high mechanical strength. The joining material selected is specifically compatible with both the cooling body material and the substrate material, ensuring both thermal and mechanical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves compatibility between heat conductivity and strength, reduces component count and weight, and maintains cooling performance without warping, allowing for efficient high-temperature operation and flexible cooling medium use.
Implementation Method 1
the main surface of the resin and the cooler are joined to each other by a joining material
Implementation Method 2
a cooling body joined to the semiconductor element
Data Source
AI summary
A cooling fin 9 is joined to a semiconductor element 1. A resin 10 encapsulates the semiconductor element 1. A portion of the cooling fin 9 projects from a lower surface of the resin 10. A cooler 11 has an opening 12. The cooling fin 9 projecting from the resin 10 is inserted in the opening 12 of the cooler 11. The lower surface of the resin 10 and the cooler 11 are joined to each other by a joining material 13 such as an adhesive. Therefore, a reduction in the number of component parts and a reduction in weight can be achieved, and compatibility between the heat conductivity and the strength of joining can be ensured.