Semiconductor Cooling Device Flow Velocity Adjusting Plate
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Solution Overview
Problem
Conventional semiconductor cooling devices face challenges in achieving uniform and stable cooling performance due to coolant drift and uneven heat generation distribution, leading to increased temperature and reduced service life of semiconductor elements.
Innovation Solution
The cooling device incorporates a water jacket with a coolant introducing flow channel, a discharge flow channel, and a flow channel for cooling, where the introducing port and discharge port are positioned on the same surface, and a flow velocity adjusting plate is used to optimize the coolant flow velocity distribution, reducing pressure loss and ensuring uniform cooling across semiconductor elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the flow rate of the coolant is increased to improve cooling efficiency, then the cooling performance is improved, but the pressure loss of the coolant increases and the load on the cooling pump increases
Solution Approach 1:
The cooling apparatus is divided into multiple independent flow channels (first flow channel, second flow channel, third flow channel) that operate in parallel. Each flow channel has its own coolant introduction and discharge paths, allowing the coolant flow to be segmented and distributed across multiple channels. This segmentation reduces the pressure loss in each individual channel while maintaining effective cooling across all heat sinks.
2Temperature
If a complex fin shape with good heat transfer coefficient is used to improve cooling efficiency, then the cooling performance is improved, but the pressure loss of the coolant increases
Solution Approach 1:
The fin shapes are optimized locally within each flow channel to achieve good heat transfer coefficients. Each flow channel can have fins tailored to its specific cooling requirements and heat sink configuration. This local optimization allows effective cooling without requiring complex fin shapes throughout the entire apparatus, thereby reducing overall pressure loss.
3Temperature
If multiple flow channels are connected in series to cool multiple power semiconductor elements, then the cooling coverage is improved, but the pressure loss becomes especially significant
Solution Approach 1:
Instead of connecting flow channels in series, the invention uses multiple flow channels connected in parallel. Each flow channel independently cools specific heat sinks, providing comprehensive cooling coverage across multiple power semiconductor elements. The parallel configuration ensures that the coolant pressure is maintained across all channels, avoiding the cumulative pressure loss that would occur in a series arrangement.
4Temperature
If the cross-section area of the flow channel is reduced to increase coolant flow velocity, then the cooling efficiency is improved, but the pressure loss increases
Solution Approach 1:
The invention addresses the flow velocity issue by adding spatial dimensions through multiple parallel flow channels arranged in the lateral direction. Instead of relying solely on reducing cross-sectional area in a single channel to increase velocity, the coolant flow is distributed across multiple channels with adequate cross-sectional areas. This dimensional approach maintains reasonable flow velocities while avoiding excessive pressure loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables uniform and stable cooling of semiconductor elements, preventing malfunction or fracture caused by heat generation, while reducing pressure loss and maintaining efficient coolant flow.
Implementation Method 1
a coolant introducing flow channel 21 for introducing the coolant and a coolant discharge flow channel 22 for discharging the coolant are arranged parallel to each other, and a plurality of heat sinks are disposed therebetween in the coolant circulation direction
Implementation Method 2
a plurality of heat sinks are disposed therebetween in the coolant circulation direction that is substantially perpendicular thereto
Data Source
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AI summary
Provided is a cooling device for a semiconductor module that eliminates the increase in temperature occurring only at some of semiconductor elements and enables uniform and stable cooling of semiconductor elements. The cooling device for a semiconductor module supplies a coolant from the outside into a water jacket (2A) and cools semiconductor elements disposed on an outer surface thereof. An introducing port (24) and a discharge port (25) are disposed at a left wall (2Ab) of the water jacket (2A), and an introducing port section (21a) and a discharge port section (22a) protrude from the same left wall (2Ab). A flow velocity adjusting plate (28) is disposed parallel to fins (2C) in a coolant discharge flow channel (22) serving as the second flow channel disposed parallel to and at a distance from a coolant introducing flow channel (21) serving as the first flow channel. The adjustment of flow velocity distribution in the fins (2C) can be performed by using the pressure generated when the coolant collides with the flow velocity adjusting plate (28).