Semiconductor Module Cooling Frame for Dense Terminal Wiring
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Solution Overview
Problem
Existing semiconductor modules face challenges in simultaneous cooling of the semiconductor module and substrate due to different heights, and the use of insulation coating with low viscosity limits film thickness, making it difficult to enhance substrate cooling performance and terminal wiring density.
Innovation Solution
A semiconductor module design featuring a circuit body, external terminals, substrate with power wiring, an insulating filling member, and a cooler with a heat dissipation member forming a frame around the circuit body, allowing for improved cooling and insulation through a low viscosity filling process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation member is disposed over the whole surface to cool the substrate, then the substrate cooling performance is improved, but the height difference between the circuit body and substrate makes simultaneous cooling difficult
Solution Approach 1:
The heat dissipation member is divided into a first heat dissipation member covering the circuit body and a second heat dissipation member covering the substrate, allowing independent optimization of each component's cooling without being constrained by height differences between them
Solution Approach 2:
Different regions of the module are provided with dedicated heat dissipation members tailored to their specific cooling needs - the first heat dissipation member for the circuit body and the second for the substrate, enabling localized thermal management that addresses the height difference issue
2Ease of manufacture
If insulation coating with low viscosity is used for spray coating, then the ease of application is improved, but the film thickness and breakdown strength cannot be increased
Solution Approach 1:
The viscosity parameter of the insulation coating is changed to a higher range (500-5000 cP) compared to conventional low viscosity coatings, enabling the coating to maintain sufficient film thickness and breakdown strength while still being applicable through spray coating methods
Solution Approach 2:
The insulation coating is applied selectively to specific regions where electrical insulation is needed, such as between adjacent external terminals, rather than requiring uniform coverage across the entire substrate, allowing optimized coating properties for the specific application
3Reliability
If the insulation coating film thickness is increased to improve breakdown strength, then the electrical insulation performance is improved, but the arrangement of the potting mold for filling becomes difficult
Solution Approach 1:
The insulation coating is applied to the substrate before the external terminals are mounted, creating a pre-formed insulation layer that prevents electrical discharge between adjacent terminals, thereby eliminating the need for complex potting mold arrangements to achieve insulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves enhanced cooling performance and high-density terminal wiring by using a heat dissipation member to enclose the circuit body, ensuring effective insulation and easy filling of the insulating material, thereby improving reliability and compactness.
Implementation Method 1
a heat dissipation member disposed between the cooler and the substrate
Data Source
AI summary
A semiconductor module includes: a circuit body having a semiconductor element, and a plurality of external terminals to be connected to the semiconductor element; a substrate having a power wiring layer to be connected to the external terminals; an insulating filling member for covering a connection part between the external terminals and the power wiring layer; a cooler having one surface side on which the circuit body and the substrate are mounted; and a heat dissipation member disposed between the cooler and the substrate. In the semiconductor module, the heat dissipation member forms a frame part on the cooler so as to enclose an outer periphery of a region where the circuit body is mounted, and the filling member is filled into an inner peripheral side of the frame part.