Semiconductor Module Cooling Body Groove Bonding
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Solution Overview
Problem
Existing semiconductor devices face challenges in securing semiconductor modules to cooling bodies without using screws, as materials suitable for bonding often compromise cooling efficiency, and those suitable for cooling may inadequately secure the module.
Innovation Solution
A semiconductor device design featuring a semiconductor module with a metal heat conductive portion and molded resin, secured to a cooling body using a bonding material and heat conductive material, where the heat conductive portion is thermally coupled to the cooling body, and the bonding material provides strong attachment without mixing with the heat conductive material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If bonding material is used to secure the semiconductor module to the cooling body, then bonding strength is improved, but cooling efficiency deteriorates
Solution Approach 1:
The bonding structure is segmented into distinct functional zones: a bonding material layer for attachment and a heat conductive material layer for thermal transfer. This segmentation allows each material to perform its specialized function without compromise, resolving the contradiction between bonding strength and cooling efficiency.
Solution Approach 2:
A heat conductive material acts as an intermediary between the semiconductor module and cooling body, positioned between the bonding material and the cooling surface. This intermediary enables effective thermal coupling while allowing the bonding material to focus on mechanical attachment, thus maintaining both bonding strength and cooling efficiency.
2Temperature
If heat conductive material is used to cool the semiconductor module, then cooling efficiency is improved, but bonding strength deteriorates
Solution Approach 1:
The interface structure is divided into separate functional layers: a bonding material layer providing mechanical strength and a heat conductive material layer providing thermal pathways. This segmentation eliminates the need for a single material to simultaneously optimize both properties, resolving the contradiction.
Solution Approach 2:
The bonding structure employs a composite arrangement of different materials: a bonding material optimized for adhesion and a heat conductive material optimized for thermal transfer. This composite structure allows each material to contribute its superior property, achieving both strong bonding and efficient cooling.
3Strength
If screws are used to secure the semiconductor module to the cooling body, then bonding strength is improved, but device complexity increases
Solution Approach 1:
The bonding and heat conduction functions are merged into a single integrated interface structure between the semiconductor module and cooling body. This eliminates the need for separate mechanical fasteners like screws, reducing part count while maintaining bonding strength through the bonding material.
Solution Approach 2:
The mechanical fastening system (screws) is replaced with a material-based bonding system using bonding material and heat conductive material. This substitution eliminates complex mechanical components while achieving equivalent or superior bonding strength with fewer parts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves substantial bonding strength and adequate cooling of the semiconductor module while reducing the number of parts, ensuring effective thermal coupling and insulation.
Implementation Method 1
heat conductive material formed between and thermally coupling the heat conductive portion and the cooling body
Data Source
AI summary
A semiconductor device includes a semiconductor module having a heat conductive portion formed of metal and also having a molded resin having a surface at which the heat conductive portion is exposed, a cooling body secured to the semiconductor module by means of bonding material, and heat conductive material formed between and thermally coupling the heat conductive portion and the cooling body.