Semiconductor Module Cooling Guide for Uniform Downstream Flow
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Solution Overview
Problem
Semiconductor modules face inefficiencies in cooling due to the use of heat spreaders, which increase the aspect ratio of the cooling fluid flow space, leading to reduced cooling efficiency and localized high temperatures, especially in high-power systems.
Innovation Solution
A semiconductor module design that omits the heat spreader and incorporates a guide to direct the flow of cooling fluid towards regions with low cooling efficiency, improving the aspect ratio and enhancing cooling efficiency without increasing pressure drop.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat spreader is used to cool semiconductor devices, then cooling coverage is improved, but the aspect ratio of the cooling fluid flow space increases and cooling efficiency decreases
Solution Approach 1:
The patent removes the heat spreader component from the semiconductor module, extracting the problematic element that caused the narrow gap and high aspect ratio. This allows the cooling fluid to flow in a larger space with improved flow characteristics while still achieving effective cooling of the semiconductor devices.
Solution Approach 2:
Instead of using a heat spreader to distribute heat and then cooling it, the patent inverts the approach by directly cooling the semiconductor devices through optimized cooling fluid flow paths. The cooling fluid is guided to flow along the side surfaces of the semiconductor devices, providing direct cooling without the intermediate heat spreader component.
2Temperature
If a heat spreader is used, then heat distribution is improved, but flow resistance increases and flow rate decreases
Solution Approach 1:
The heat spreader is completely removed from the system, eliminating the source of flow resistance that it created. The cooling fluid flows directly through the module with unrestricted paths along the semiconductor device side surfaces, maintaining low flow resistance while still achieving uniform heat distribution through direct cooling.
3Temperature
If a heat spreader is used, then thermal management is improved, but device complexity increases
Solution Approach 1:
The heat spreader component is extracted from the module structure, simplifying the overall design. The patent achieves thermal management through a simpler configuration where cooling fluid flows directly along the semiconductor device side surfaces, eliminating the need for additional heat spreading components and reducing structural complexity.
Solution Approach 2:
The cooling fluid serves multiple functions simultaneously: it cools the top surfaces of the semiconductor devices through the PCB and directly cools the side surfaces of the devices. This multi-functional cooling approach eliminates the need for separate heat spreader components, achieving both heat distribution and cooling with a single cooling system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves cooling efficiency by reducing the aspect ratio of the flow space and ensuring uniform cooling across the semiconductor module, preventing localized temperature increases and maintaining system performance.
Implementation Method 1
The guide may be partially positioned corresponding to a downstream region to induce the flow of the cooling fluid to a region adjacent to a lower end of the downstream region having relatively low cooling efficiency
Data Source
AI summary
A semiconductor module includes a semiconductor module body and a guide. The semiconductor module body extends in a first direction and a second direction intersecting the first direction. A plurality of connection terminals is arranged at one end of the semiconductor module in the second direction. A plurality of semiconductor devices is arranged on at least one side of the semiconductor module body. The guide is arranged at the other end of the semiconductor module body opposite to the one end to induce a flow of a cooling fluid toward the one end of the semiconductor module.