Semiconductor Circuit Cooling via Heat Sink Protrusions Through PCB

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Solution Overview

Problem

Existing heat dissipation structures in electronic circuit apparatuses face challenges such as insufficient heat dissipation performance due to limited cross-sectional area of heat vias, high processing costs, and increased number of parts leading to heat transfer resistance.

Innovation Solution

The proposed solution involves an electronic circuit apparatus with a substrate having a through hole facing the back surface of a semiconductor device, a heat sink with protruding portions that penetrate into the through hole, and a heat-dissipating material between the semiconductor device and the heat sink, reducing heat transfer resistance and improving heat dissipation performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat via is used to conduct heat from the semiconductor to the base, then heat dissipation is achieved, but the cross-sectional area is limited and processing cost is high

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidprocessing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The invention extracts the heat dissipation function from the substrate's heat via and relocates it to a dedicated heat sink component. The heat sink is positioned adjacent to the semiconductor device's back surface, separating the heat dissipation function from the electrical circuit substrate, thereby achieving better thermal management without increasing substrate processing complexity.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention introduces a heat-dissipating member as an intermediary component between the semiconductor device and the heat sink. This member fills the through-hole in the substrate and provides a thermal conduction path, mediating the heat transfer from the semiconductor to the heat sink while maintaining electrical insulation and reducing thermal resistance.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If a heat-dissipating member is inserted into a through hole and joined to housing via heat-conducting member, then heat dissipation is improved, but the number of parts increases and bonding materials create heat transfer resistance

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidnumber of parts

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The invention merges the heat-dissipating member with the substrate structure by having the heat-dissipating member fill the through-hole and be integrally formed with the substrate or firmly bonded to it. This integration reduces the number of separate parts and eliminates the need for additional bonding materials between the heat-dissipating member and the substrate, thereby reducing thermal resistance.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The substrate serves multiple functions: it provides electrical connections through its circuit patterns and simultaneously serves as a structural support and thermal management component through the integrated heat-dissipating member in the through-hole. This multi-functionality reduces the overall number of components needed in the system.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces heat transfer resistance and improves heat dissipation performance by allowing the heat sink's protruding portions to directly approach the semiconductor device, thus enhancing thermal conductivity and reducing processing costs.

Implementation Method 1

a heat-dissipating material disposed at least between the back surface of the semiconductor device and a top surface of the protruding portion of the heat sink

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

the top surface of the protruding portion, which is a heat receiving surface of the heat sink, approaches the back surface of the semiconductor device

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250029889A1Electronic circuit apparatus and circuit-integrated motor

Publication Date: 2025.01.23 MIKUNI CORP

AI summary

An electronic circuit apparatus 1 includes: at least one semiconductor device 10; a substrate 20 installed with the semiconductor device 10 and having a through hole 24 at a position facing a back surface 17 of the semiconductor device 10; a heat sink 30 located on an opposite side of the substrate 20 from the semiconductor device 10 and having at least one protruding portion 32 protruding toward the back surface 17 of the semiconductor device 10 so as to penetrate into the through hole 24 of the substrate 20; and a heat-dissipating material 40 disposed at least between the back surface 17 of the semiconductor device 10 and a top surface 33 of the protruding portion 32 of the heat sink 30.