Semiconductor Cooling Structure Using Latent Heat Storage
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Solution Overview
Problem
Existing semiconductor element cooling structures face challenges in efficiently absorbing sudden and large heat increases without increasing the volume of the heat sink, as latent heat storage materials are less effective under normal conditions and conventional heat sinks struggle with rapid heat absorption.
Innovation Solution
A semiconductor element cooling structure that incorporates a heat storage member with a latent heat storage material, an electrically conductive outer shell, and a heat transfer member, allowing for phase change-based heat absorption while maintaining efficient cooling performance and preventing heat sink volume increase, along with stress absorption features to manage thermal expansion differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the heat sink volume is increased to absorb large amounts of heat, then the heat absorption capacity is improved, but the device volume and heat resistance increase, degrading cooling performance under normal conditions
Solution Approach 1:
The cooling system is divided into two separate components: a heat sink for normal cooling and a heat storage member for emergency heat absorption. This segmentation allows each component to be optimized for its specific function without compromising the other, resolving the contradiction between heat absorption capacity and device volume.
Solution Approach 2:
The heat storage member utilizes phase change of latent heat storage material to dramatically change its heat absorption parameters. During phase transition, the material absorbs large amounts of heat without temperature increase, enabling high heat absorption capacity in a compact form factor that doesn't increase heat sink volume.
2Quantity of substance
If a latent heat storage material is used to absorb heat, then heat absorption during phase change is improved, but the material becomes less effective under normal cooling conditions
Solution Approach 1:
The system separates the latent heat storage material into a distinct heat storage member, allowing it to specialize in emergency heat absorption during phase change while the heat sink handles normal cooling conditions. This segmentation enables each component to excel at its specific function without compromise.
Solution Approach 2:
The heat storage member is designed to dynamically activate during emergency conditions when the semiconductor element generates excessive heat. The phase change material transitions from inactive to active heat absorption mode based on temperature conditions, providing adaptive cooling that responds to changing thermal demands.
3Quantity of substance
If the heat storage member is made large to occupy more area for heat absorption, then heat absorption capacity is improved, but wiring arrangement becomes more difficult
Solution Approach 1:
The outer shell of the heat storage member serves multiple functions: it provides structural containment for the phase change material, acts as a thermal conduction path for heat transfer, and functions as an electrical connection component. This multi-functionality eliminates the need for separate wiring, allowing the heat storage member to occupy large area without increasing wiring complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure effectively absorbs sudden heat increases through phase change, enhances cooling performance, and prevents heat sink volume expansion, ensuring continuous and efficient cooling even under heavy loads.
Implementation Method 1
heat absorption associated with a phase change of a material
Implementation Method 2
storing heat by means of heat absorption associated with a phase change of a material
Implementation Method 3
cooling of the semiconductor element by the heat sink
Implementation Method 4
cooling medium, mixing, into a cooling medium
Data Source
AI summary
A semiconductor element cooling structure includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a heat storage member attached to the semiconductor element in a manner to be located opposite to the heat sink with respect to the semiconductor element and having a case and a latent heat storage material.