Power Semiconductor Cooling Layout for Low-Inductance Downsizing
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Solution Overview
Problem
Conventional power semiconductor devices face challenges in achieving both low inductance and downsizing due to increased area requirements for sealing refrigerant and complex flow paths, which complicate the device size and cooling performance.
Innovation Solution
A power semiconductor device design that includes a power semiconductor element, conductive sections, circuit components, and a sealing member forming dual flow paths for refrigerant, with thermal connections to both the power circuit and circuit components, enhancing mounting density and cooling performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the sealing area for refrigerant is increased, then the cooling performance is improved, but the device size increases and the distance between capacitor and driver circuit increases causing higher inductance
Solution Approach 1:
The flow path is segmented into multiple regions (first region thermally connected to power circuit, second region thermally connected to circuit component) within the sealing member, allowing efficient cooling without requiring a large overall sealing area. This segmentation enables targeted cooling of different heat-generating components.
Solution Approach 2:
The sealing member integrates multiple functions: it seals the refrigerant, forms the flow path, and provides thermal connection to both the power circuit and circuit components. This merging of sealing and cooling functions into a single component achieves effective cooling without increasing device size or inductance.
2Temperature
If the sealing area for refrigerant is increased, then the cooling performance is improved, but the device size increases
Solution Approach 1:
The flow path utilizes the thickness direction (third dimension) of the sealing member by forming through-holes that extend through the sealing member. This three-dimensional flow path configuration allows efficient refrigerant circulation and heat dissipation without increasing the planar area of the device.
Solution Approach 2:
The flow path is nested within the sealing member structure itself, with through-holes formed through the sealing member. This nested configuration allows the cooling system to be integrated within the existing device footprint without requiring additional external cooling components or increased device volume.
3Temperature
If separate flow paths are added to cool different components, then the cooling coverage is improved, but the flow path complexity increases
Solution Approach 1:
The sealing member serves as a multi-functional component that simultaneously seals the refrigerant and provides a unified flow path for cooling multiple different components (power circuit and circuit components). This universal sealing member with integrated flow path eliminates the need for separate cooling systems for different components.
Solution Approach 2:
Multiple cooling functions for different components are merged into a single unified flow path system within the sealing member. The first and second regions of the flow path both communicate through the sealing member, providing comprehensive cooling coverage without requiring multiple separate flow paths or cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves both low inductance and downsizing by improving circuit component mounting density and cooling performance, with increased refrigerant flow rates and reduced pressure loss.
Implementation Method 1
a first region thermally connected to the power circuit, and a second region thermally connected to the circuit component
Data Source
AI summary
A power semiconductor device according to the present invention is provided with a conductive section, a circuit component, a substrate that supports the conductive section and the circuit component, and a sealing member, wherein the sealing member forms a first flow path, and the first flow path has a first region thermally connected to a power circuit and a second region thermally connected to the circuit component.