Semiconductor Module Cooling Member Placement
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Solution Overview
Problem
Conventional semiconductor devices for power conversion in inverter circuits face issues with heat dissipation, leading to increased temperatures in passive elements like capacitors and longer conductive members, which result in higher inductance and potential malfunctions.
Innovation Solution
The semiconductor device incorporates a cooling member between the semiconductor module and passive elements, with conductive members electrically connecting them on both sides of the cooling member, allowing for enhanced heat dissipation and reduced heat transfer, while also minimizing the length of conductive members to suppress inductance increases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling member is disposed between the semiconductor module and passive element, then heat transfer from semiconductor module to passive element is suppressed, but device complexity increases
Solution Approach 1:
A cooling member is introduced as an intermediary component between the semiconductor module and passive element. This cooling member serves as a thermal mediator that absorbs heat from the semiconductor module and dissipates it, preventing heat transfer to the passive element. The cooling member acts as a buffer that mediates the thermal interaction between the heat-generating semiconductor module and the heat-sensitive passive element.
2Reliability
If conductive members are made longer to connect semiconductor module and passive element, then electrical connection is achieved, but inductance increases
Solution Approach 1:
The conductive members are arranged to extend in multiple spatial dimensions rather than a single linear path. By utilizing three-dimensional space efficiently, the conductive members can achieve reliable electrical connection while minimizing their overall length and reducing inductance. The arrangement allows current to flow through optimized paths that reduce loop area and inductive effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the increase in temperature of passive elements due to heat from semiconductor modules, promotes heat dissipation, and reduces inductance, thereby enhancing the reliability and efficiency of power conversion in inverter circuits.
Implementation Method 1
heat dissipation from the conductive member, which is electrically connecting the semiconductor module and the passive element, to the cooling member is promoted
Implementation Method 2
a cooler is disposed between a semiconductor module and a capacitor, and a capacitor terminal connecting the capacitor and a semiconductor element is thermally in contact with the cooler so as to cool the capacitor terminal
Data Source
AI summary
A semiconductor device includes a semiconductor module including a semiconductor element, a passive element, a cooling member, a first conductive member and a second conductive member. The cooling member is disposed between the semiconductor module and the passive element. And a first conductive member and a second conductive member electrically connect the semiconductor module and the passive element. Furthermore, two or more aspects of at least one of the first conductive member and the second conductive member face the cooling member.