Semiconductor Cooling via Metal-Filled Vias and Thermoelectric Cooler
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Solution Overview
Problem
Current thermal management techniques for semiconductor chips, such as heat sinks and thermoelectric coolers, are inefficient in directly reducing semiconductor device temperature due to high thermal resistance materials, which affects noise performance in electronic circuits.
Innovation Solution
A semiconductor cooling system that incorporates metal-filled vias and a thermoelectric cooler, where metal-filled vias provide a thermal path for heat removal and thermally insulating vias confine heat output, allowing the thermoelectric cooler to efficiently lower semiconductor device temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal management techniques (heat sinks, heat spreaders) are used, then heat dissipation is achieved, but semiconductor device temperature is not effectively reduced due to high thermal resistance materials
Solution Approach 1:
The patent segments the thermal management approach by introducing separate functional vias: metal-filled vias for heat conduction and thermally insulating vias for heat confinement. This segmentation allows independent optimization of heat removal paths and thermal isolation, directly addressing the contradiction between heat dissipation and device temperature reduction.
Solution Approach 2:
The patent applies local quality by creating localized thermal management zones around specific semiconductor devices. Metal-filled vias are positioned adjacent to devices requiring cooling, while thermally insulating vias are positioned to confine heat to specific regions. This localized approach enables effective temperature control of individual devices without affecting the entire chip, improving noise performance where critical.
2Power
If thermoelectric cooler is used, then cooling capability is provided, but efficiency is reduced due to high thermal resistance surrounding the semiconductor device
Solution Approach 1:
The patent introduces metal-filled vias as thermal intermediaries between the semiconductor device and the thermoelectric cooler. These vias provide a low thermal resistance path that mediates heat transfer from the device to the cooler, overcoming the high thermal resistance of surrounding materials and improving cooling efficiency and noise performance.
Solution Approach 2:
The patent employs composite thermal management structures combining metal-filled vias (high thermal conductivity) with thermally insulating vias (low thermal conductivity) in a single integrated system. This composite approach allows simultaneous heat removal through metal vias and heat confinement through insulating vias, enhancing the overall effectiveness of the thermoelectric cooler.
3Loss of energy
If metal-filled vias are used to conduct heat, then thermal path is improved, but heat confinement is reduced
Solution Approach 1:
The patent segments the via structure into two distinct types: metal-filled vias for heat conduction and thermally insulating vias for heat confinement. This segmentation resolves the contradiction by assigning separate functions to separate structural elements, allowing heat to be efficiently removed through metal vias while insulating vias prevent heat from spreading to unwanted regions.
Solution Approach 2:
The patent merges two opposing thermal management functions (heat conduction and heat insulation) into a single integrated via system. By combining metal-filled vias and thermally insulating vias in the same substrate structure, the patent achieves both efficient heat removal and localized heat confinement simultaneously, resolving the apparent contradiction between the two functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces semiconductor device temperature, enhancing noise performance and heat dissipation efficiency by utilizing metal-filled vias to direct heat to a thermally conducting layer and thermally insulating vias to localize heat output, thereby improving thermal management.
Implementation Method 1
Thermal energy is drawn from the cold side to the hot side at a rate which is proportional to carrier current passing through the circuit and the number of couples
Implementation Method 2
a plurality of electrically inactive metal-filled vias extending through the semiconductor portion... provide a thermal path for heat removal
Implementation Method 3
thermally insulating vias confine heat output
Data Source
AI summary
A system and method in which a semiconductor chip has electrically inactive metal-filled vias adjacent to a semiconductor device or devices to be cooled and the semiconductor device or devices are preferably surrounded by thermally insulating vias. The metal-filled vias are contacted with a thermoelectric cooler to remove excess heat from the semiconductor device or devices.