Semiconductor Cooling Device with Parallel Refrigerant Channels
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Solution Overview
Problem
Existing cooling devices for semiconductor components suffer from insufficient cooling effects in the central part due to thermal interference, as the coolant flows sequentially from one end of the cooling channel, leading to increased temperatures and potential thermal runaway.
Innovation Solution
A cooling device design featuring a base mounted on the back surface of a substrate with a bottom plate having an introduction port for refrigerant flow opposite to the base, allowing direct refrigerant supply to the central region of semiconductor components, enhancing cooling efficiency by ensuring continuous low-temperature refrigerant delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the coolant flows sequentially from one end of the cooling channel in the lateral direction, then the cooling device structure is simple, but the cooling effect in the central part is insufficient due to thermal interference
Solution Approach 1:
The cooling channel is divided into multiple independent channels arranged in parallel. Each channel independently guides coolant to cool semiconductor components, preventing thermal interference in the central region while maintaining structural simplicity through modular channel design.
Solution Approach 2:
The coolant flow direction is changed from lateral (one-dimensional sequential flow) to vertical (two-dimensional parallel flow through multiple channels). This dimensional change allows simultaneous cooling of multiple regions including the central part, resolving the thermal interference problem.
2Productivity
If multiple semiconductor components are mounted closely, then the device integration is high, but thermal interference occurs and central temperature increases
Solution Approach 1:
Multiple independent cooling channels are created, each responsible for cooling specific semiconductor components. This segmentation allows high-density mounting while providing dedicated cooling paths that prevent thermal accumulation and interference in the central region.
Solution Approach 2:
Each cooling channel is positioned to provide localized cooling to specific semiconductor components. The coolant is delivered directly to heat-generating regions, ensuring uniform temperature distribution across densely packed components and preventing central temperature rise.
3Device complexity
If the coolant flows sequentially through the cooling channel, then the cooling system is simple, but the cooling efficiency in the central region decreases
Solution Approach 1:
The cooling system is segmented into multiple parallel channels that operate simultaneously. This segmentation increases cooling efficiency by providing concurrent cooling to different regions, including the central part, while keeping each individual channel simple in structure.
Solution Approach 2:
Multiple cooling channels operate continuously and simultaneously to cool semiconductor components throughout the device. This continuous parallel action ensures sustained cooling efficiency in all regions, particularly the central region, without requiring complex sequential control mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves cooling efficiency by directly supplying refrigerant to the central region, reducing thermal interference and preventing thermal runaway, thereby enhancing the overall cooling performance.
Implementation Method 1
a cooling device that cools a semiconductor component (2) mounted on a surface of a substrate (1)
Data Source
AI summary
A cooling device that cools a semiconductor component mounted on a surface of a substrate, and includes a base mounted to a back surface of the substrate and a bottom plate disposed separately from the base. An introduction port that guides a refrigerant from a direction opposite to the back surface is formed at a position corresponding to the semiconductor component in the bottom plate.