Semiconductor Module Cooling Pipe Surrounding Design
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Solution Overview
Problem
Existing semiconductor devices with water cooling systems face a height increase due to the placement of coolers on the lower surface, which can occupy more space and affect the overall structure's compactness.
Innovation Solution
A semiconductor device design where a cooler with a metal base and a cooling pipe is positioned to surround the semiconductor module, allowing for efficient heat dissipation while maintaining a low profile by circulating refrigerant through the cooling pipe to cool the module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooler is disposed on the lower surface of the semiconductor device, then heat dissipation is achieved, but the height of the entire structure increases
Solution Approach 1:
The cooling pipe is configured to extend along the side surface of the semiconductor module in a plan view, transitioning from a purely vertical cooling approach to a lateral cooling path. This dimensional change allows the cooling function to be achieved while maintaining a compact height profile, as the cooling path utilizes the horizontal space around the module rather than extending vertically downward.
2Temperature
If the cooling pipe surrounds the semiconductor module in plan view, then heat dissipation efficiency is improved, but the device complexity increases
Solution Approach 1:
The cooler structure merges the metal base and cooling pipe into a single integrated component. The cooling pipe is directly formed on the metal base, eliminating the need for separate assembly steps and reducing structural complexity. This integration maintains the surrounding cooling path that improves heat dissipation efficiency while simplifying the overall cooler structure.
Solution Approach 2:
The cooling pipe is configured as a thin-walled structure that can flexibly surround the semiconductor module. This thin-film approach allows the cooling pipe to conform to the module's shape and surrounding space, achieving effective heat dissipation through the lateral path while minimizing the volume and complexity of the cooling structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat from the semiconductor device while keeping the overall structure height low, optimizing space usage and cooling efficiency.
Implementation Method 1
a cooling pipe disposed on an upper surface of the metal base, the cooling pipe being configured to circulate a refrigerant for cooling the semiconductor module
Data Source
AI summary
Heat from a semiconductor device is effectively dissipated while the height of the semiconductor device is kept low. A semiconductor device includes a cooler configured to cool a semiconductor module. The semiconductor module includes: a metal block, a semiconductor element, a terminal connected to the semiconductor element, and a resin covering a part of the terminal, the metal block, and the semiconductor element. The cooler includes: a metal base including the semiconductor module in a plan view while being in contact with a lower surface of the semiconductor module, and a cooling pipe disposed on an upper surface of the metal base and configured to cool the semiconductor module. The cooling pipe at least partially surrounds the semiconductor module in a plan view.