Semiconductor Module Cooling Protrusions for Thermal Dissipation
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Solution Overview
Problem
Conventional semiconductor cooling structures face inefficiencies in heat dissipation and mechanical strength, leading to larger and less effective cooling solutions.
Innovation Solution
A semiconductor module design featuring a laminated substrate with a cooling portion that includes a refrigerant passing portion, metal interconnection layers, and protruding parts on the bottom plate to enhance heat exchange and mechanical strength, allowing for a thinner and more efficient cooling structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional cooling structures are used, then cooling function is provided, but the module size becomes large and mechanical strength is insufficient
Solution Approach 1:
The invention transitions from a conventional planar cooling structure to a three-dimensional structure by adding protruding parts that extend upward from the bottom plate into the refrigerant passage. This vertical dimensionality allows the cooling structure to achieve both compact size and enhanced mechanical strength without increasing the horizontal footprint of the module.
Solution Approach 2:
The protruding parts are nested within the refrigerant passage space, utilizing the available vertical volume without requiring additional external space. The cooling structure integrates multiple functional elements (bottom plate, protruding parts, heat dissipation surfaces) in a nested configuration that maximizes space utilization while maintaining structural integrity.
2Temperature
If cooling efficiency is improved through larger structures, then heat dissipation performance increases, but the module becomes less compact
Solution Approach 1:
The cooling structure implements local quality enhancement by concentrating heat dissipation functionality in the protruding parts that directly contact the refrigerant flow. The protruding parts are strategically positioned to maximize thermal exchange with the refrigerant, providing localized high-performance cooling without requiring a uniformly large structure throughout the entire module.
Solution Approach 2:
By extending the cooling surfaces vertically through the protruding parts rather than only horizontally, the invention increases the effective heat exchange area within a compact footprint. This vertical expansion allows the module to achieve high heat dissipation efficiency without proportionally increasing the overall module volume.
3Volume of moving object
If the cooling structure is made thinner for miniaturization, then module size decreases, but mechanical strength and cooling efficiency are compromised
Solution Approach 1:
The invention compensates for the reduced thickness in the horizontal direction by adding vertical dimension through the protruding parts. This creates a three-dimensional structural configuration where the cooling structure maintains adequate mechanical strength through its vertical extent while keeping the horizontal footprint compact for miniaturization.
Solution Approach 2:
The cooling structure employs a composite configuration combining the bottom plate and multiple protruding parts made of thermally conductive material. This composite structure integrates both mechanical support functions and thermal management functions in a single integrated component, achieving structural integrity and cooling efficiency simultaneously in a compact form.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved thermal dissipation and mechanical strength, enabling miniaturization of the semiconductor module while maintaining or exceeding the cooling efficiency of larger comparative examples.
Implementation Method 1
a cooling portion (10), having a refrigerant passing portion (20) inside
Implementation Method 2
the plurality of protruding parts (22) are separated from each other in a flow direction from an upstream to a downstream of the refrigerant
Data Source
Figure 1
Figure 2(A)~2(C)
Figure 3
AI summary
Provided is a semiconductor module comprising: a semiconductor chip; a cooling portion having a refrigerant passing portion inside, the refrigerant passing portion through which a refrigerant passes; and a laminated substrate having: a first metal interconnection layer closer to the semiconductor chip than to the cooling portion; a second metal interconnection layer closer to the cooling portion than to the semiconductor chip; and an insulation provided between the first metal interconnection layer and the second metal interconnection layer, wherein the cooling portion has: a top plate; a bottom plate provided facing the top plate; and a plurality of protruding parts which are provided on a surface of the bottom plate contacting the refrigerant passing portion, and are separated from each other in a flow direction from an upstream to a downstream of the refrigerant, and are respectively provided continuously in a width direction of the refrigerant passing portion orthogonal to the flow direction, wherein the plurality of protruding parts are at least provided at a position overlapping with one end of the second metal interconnection layer and at a position overlapping with the semiconductor chip in the flow direction.