Semiconductor Module Cooling Body With Integrated Pulsating Heat Pipe
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Solution Overview
Problem
Existing semiconductor module assemblies face challenges in achieving effective and cost-effective heat dissipation, as they often require additional components like copper base plates and complex connecting elements, which increase costs and thermal resistance.
Innovation Solution
A semiconductor module assembly utilizing a pulsating heat pipe integrated within a cooling body, where a heat-transporting fluid is hermetically sealed between the cooling body main body and attachment, forming a thermally conductive connection directly with the semiconductor module, eliminating the need for additional components and enhancing heat dissipation through orthogonal channel arrangements and direct fluid contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If additional components like copper base plates and complex connecting elements are used, then thermal conductivity is improved, but device complexity and production costs increase
Solution Approach 1:
The patent merges the cooling body attachment directly with the semiconductor module substrate, eliminating the need for separate copper base plates and complex connecting elements. The channel structure is integrated into the cooling body attachment itself, creating a unified component that reduces part count while maintaining effective heat dissipation through direct thermal contact.
Solution Approach 2:
The cooling body attachment serves multiple functions simultaneously: it provides mechanical support for the semiconductor module, acts as a thermal pathway for heat dissipation, and contains the integrated channel structure for heat-transporting fluid flow. This multi-functional design eliminates the need for separate components and reduces overall device complexity.
2Temperature
If additional components like copper base plates are used, then thermal conductivity is improved, but production costs increase
Solution Approach 1:
By integrating the channel structure directly into the cooling body attachment and eliminating separate copper base plates, the patent reduces the number of manufacturing steps, assembly operations, and associated costs. The unified design allows for more straightforward production processes while achieving comparable or superior thermal performance.
Solution Approach 2:
The patent employs a cost-effective cooling body attachment design that eliminates expensive copper base plates and complex connecting elements. The integrated structure uses materials and manufacturing methods that are more economical while still achieving the required thermal management performance for the application.
3Temperature
If complex connecting elements are used, then thermal conductivity is improved, but device complexity and assembly difficulty increase
Solution Approach 1:
The patent combines the cooling body attachment with the semiconductor module substrate into a single integrated unit, eliminating the need for complex connecting elements. This integration simplifies the assembly process significantly, as the thermal pathway is built-in rather than requiring separate assembly steps with multiple components.
Solution Approach 2:
The cooling body attachment is designed to self-align and self-contact with the semiconductor module substrate, eliminating the need for complex alignment mechanisms or precision assembly procedures. The integrated design ensures proper thermal contact is achieved automatically during the assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat dissipation without additional components, reducing thermal resistance and production costs, while maintaining effective thermal conductivity, even with plastic or dielectric materials, thus improving power density and reliability.
Implementation Method 1
the hermetically sealed channel structure and the heat-transporting fluid form a pulsating heat pipe which is thermally conductively connected to the semiconductor module
Implementation Method 2
the hermetically sealed channel structure and the heat-transporting fluid form a pulsating heat pipe
Implementation Method 3
both the cooling body attachment and the cooling body main body are in direct contact with the heat-transporting fluid
Data Source
AI summary
A semiconductor module assembly includes a cooling body having a cooling body main body and a cooling body attachment with a channel structure for a heat-transporting fluid. The channel structure is hermetically sealed with a cooling body main body surface so that the cooling body attachment and the cooling body main body are in direct contact with the heat-transporting fluid. The cooling body attachment includes a central piece having essentially parallel channels of the channel structure, and end pieces arranged on both sides of the central piece. Each end piece has deflection channels of the channel structure, which are arranged to establish a fluidic connection between the essentially parallel channels of the central piece. A semiconductor module contacts the cooling body, with the hermetically sealed channel structure of the cooling body attachment and the heat-transporting fluid forming a pulsating heat pipe which is thermally conductively connected to the semiconductor module.