Semiconductor Cooling Device with Pulsed Airjet and Passive Heat Sink
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Solution Overview
Problem
Existing semiconductor cooling devices face inefficiencies in heat transfer, noise generation, dust intake, and cost due to suboptimal airflow and fan-based cooling systems, which can compromise the performance and longevity of semiconductor devices like LEDs.
Innovation Solution
A semiconductor cooling device with a housing and heat dissipator that utilizes forced fluid flow through a channel assembly, allowing air to flow along the heat dissipator in a specific direction, reducing dust intake and noise by eliminating internal fans, and incorporating a pulsed airjet generator for enhanced heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fans are used to cool each LED, then cooling efficiency is improved, but noise generation increases and device cost increases
Solution Approach 1:
The patent extracts the fan components from the LED cooling system and replaces them with a passive heat sink design that utilizes natural convection and radiation. The heat sink includes fins and a heat pipe structure that dissipate heat without requiring active mechanical cooling, thereby eliminating noise generation while maintaining cooling effectiveness.
Solution Approach 2:
The heat sink is designed to self-regulate temperature through passive thermal management. The heat pipe structure automatically transfers heat from the LED junction to the heat sink fins, and the fins naturally dissipate heat to the surrounding air through convection and radiation without requiring external power or control mechanisms.
2Temperature
If multiple fans are employed for cooling, then cooling coverage is improved, but device complexity and cost increase
Solution Approach 1:
The patent combines multiple cooling functions into a single integrated heat sink structure. The heat sink incorporates heat pipes, fins, and radiation surfaces that work together as a unified system to cool multiple LEDs simultaneously, replacing what would otherwise require multiple separate fan assemblies and individual cooling channels.
Solution Approach 2:
The heat sink structure serves multiple functions: it acts as a thermal conductor via heat pipes, a heat dissipation surface through fins, and a radiation element. This multi-functional design enables a single component to provide comprehensive cooling coverage for multiple LEDs without requiring multiple specialized components.
3Temperature
If air flow passes from one LED heat sink assembly to another, then cooling is provided, but heat transfer efficiency is not optimized and dust is drawn into the housing
Solution Approach 1:
The patent segments the cooling system into independent heat sink units, each with its own optimized heat dissipation pathways. Each LED has a dedicated heat sink with fins and heat pipes that create localized, efficient heat transfer zones, preventing heat recirculation between LEDs and optimizing thermal management for each individual component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved cooling efficiency, reduced noise, minimized dust intake, and a more compact, cost-effective design, enabling effective thermal management for semiconductor devices without the need for internal fans, thus enhancing performance and longevity.
Implementation Method 1
the heat dissipator is for thermally coupling, in operation, to the semiconductor die
Implementation Method 2
the heat dissipator is in contact, in operation, with a fluid medium outside the housing
Implementation Method 3
incorporating a pulsed airjet generator for enhanced heat transfer efficiency
Data Source
Figure 1~3
Figure 4A~4B
Figure 5
AI summary
A semiconductor cooling device for transferring heat from a semiconductor die (111). The semiconductor cooling device includes a heat dissipator (112) that may be thermally coupled to a semiconductor module(111)to be cooled for dissipating heat from the semiconductor die (111); a housing (150) in or on which the semiconductor die (111) is mounted; a fluid flow passage (153) for providing a forced fluid flow within the housing(150); and a fluid path (155)arranged to guide the forced fluid flow in a first direction between the fluid flow passage (153) and the heat dissipator (112) and further arranged to guide the fluid flow along the heat dissipator (112) in a second direction different to the first direction. In a particular embodiment, the semiconductor cooling device is used to dissipate heat from an array of LEDs.