Semiconductor cooling refrigerator
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Solution Overview
Problem
Existing semiconductor refrigerators face inefficiencies in heat radiation at the hot end, particularly when dealing with high heat flow density sources like semiconductor cooling plates, as conventional sintered heat pipes fail to effectively transfer heat.
Innovation Solution
The design incorporates multiple sintered heat pipes with closed main pipes, featuring a first segment thermally connected to the semiconductor cooling plate and a second segment with manifolds that radiate heat to the ambient environment, along with a blower system to enhance airflow between plate fins, improving heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional sintered heat pipes are used for heat radiation at the hot end, then the structure is simple, but the heat radiation efficiency is insufficient for high heat flow density sources
Solution Approach 1:
The heat pipe is divided into multiple independent main pipes, each containing a vaporization section, condensation section, and manifold. This segmentation allows each pipe to independently handle heat transfer, increasing the overall heat radiation efficiency while maintaining manufacturing simplicity through modular construction
Solution Approach 2:
The patent introduces manifolds that extend from the condensation section in a direction perpendicular to the main heat flow path. This dimensional extension creates additional heat radiation surfaces, allowing heat to be dissipated in multiple directions simultaneously, thereby significantly improving heat radiation efficiency for high heat flow density applications
2Reliability
If heat is radiated from the hot end of the semiconductor cooling plate, then the refrigeration function is achieved, but high heat flow density requires more complex heat radiation structures
Solution Approach 1:
The main pipes serve multiple functions: they conduct heat from the vaporization section to the condensation section, provide structural support, and through their manifolds, create additional heat radiation surfaces. This multi-functionality allows the system to maintain reliable refrigeration while managing high heat flow density without requiring separate dedicated components for each function
Solution Approach 2:
The patent merges the heat conduction function and heat radiation function into a single integrated heat pipe structure. The manifolds are directly formed as part of the main pipe structure, combining the vaporization section, condensation section, and radiation surfaces into one unified component, thereby reducing overall device complexity while effectively handling high heat flow density
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly enhances heat radiation efficiency, allowing the semiconductor refrigerator to effectively manage high heat flow densities and improve energy efficiency.
Implementation Method 1
A semiconductor refrigerator achieves refrigeration by using automatic voltage-and-current changing techniques and semiconductor cooling plates which radiate and transfer heat through highly efficient two-layered loop heat pipes
Implementation Method 2
When one end of the sintered heat pipe is heated, the liquid in the capillary core is evaporated and vaporized. The vapors flow to the other end due to a slight pressure difference, emits heat and condenses into liquid again
Implementation Method 3
When one end of the sintered heat pipe is heated, the liquid in the capillary core is evaporated and vaporized
Implementation Method 4
The vapors flow to the other end due to a slight pressure difference, emits heat and condenses into liquid again
Implementation Method 5
Then, the liquid flows to the evaporating segment again under the capillary force along porous materials
Implementation Method 6
A semiconductor refrigerator, also called a thermoelectric refrigerator, achieves refrigeration by using automatic voltage-and-current changing techniques and semiconductor cooling plates
Implementation Method 7
along with a blower system to enhance airflow between plate fins, improving heat transfer efficiency
Data Source
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AI summary
The present invention is related to a semiconductor refrigerator. The semiconductor refrigerator comprising a semiconductor cooling plate and a hot end heat radiating device, wherein the hot end heat radiating device comprises multiple sintered heat pipes, each having a main pipe with both ends closed, wherein the main pipe comprises a first pipe segment thermally connected with a hot end of the semiconductor cooling plate, and a second pipe segment, which is located above the first pipe segment, and from whose one or more portions extend one or more manifolds to radiate heat from the hot end of the semiconductor cooling plate to an ambient environment. In the semiconductor refrigerator of the present invention, as multiple manifolds for radiating heat or transferring cold extend from the second pipe segment of the main pipe of each sintered heat pipe, the heat radiating or cold transferring efficiency of the semiconductor refrigerator is considerably improved, enabling the sintered heat pipe to adapt to heat sources of a high heat flow density, such as semiconductor cooling plates, for radiating heat, and enabling the semiconductor refrigerator of the present invention to have higher energy efficiency.