Semiconductor Apparatus Cooling with Slit Plate Airflow Equalization
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Solution Overview
Problem
In semiconductor apparatuses with vertically disposed units, varying airflow speeds across stages lead to uneven cooling effects, reducing the overall cooling efficiency.
Innovation Solution
A semiconductor apparatus with a partition plate and slit plates that regulate airflow speeds by adjusting the opening ratios at specific openings, ensuring equal airflow distribution across vertically disposed semiconductor units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If semiconductor units are vertically disposed with a single cooling fan at the top, then the device structure is simplified, but the airflow speeds at different stages become unequal leading to reduced cooling efficiency
Solution Approach 1:
The partition plate divides the cooling space into multiple stages, and the slit plate segments the airflow path into multiple channels. This segmentation allows independent control of airflow distribution to each vertical stage, enabling equalization of airflow speeds across different levels while maintaining a relatively simple overall structure.
Solution Approach 2:
The slit plate introduces local quality by creating different opening ratios at different positions. The opening ratio is adjusted locally at each stage to compensate for the natural decay of airflow speed with height, ensuring that each vertical stage receives appropriate airflow for effective cooling.
2Temperature
If airflow speed is increased to improve cooling at upper stages, then cooling at those stages improves, but cooling at lower stages becomes excessive and energy consumption increases
Solution Approach 1:
The slit plate implements local quality by setting different opening ratios at different vertical positions. Lower stages have smaller opening ratios to restrict excessive airflow, while upper stages have larger opening ratios to ensure sufficient cooling. This localized control optimizes the cooling effect at each stage and prevents energy waste.
Solution Approach 2:
The opening ratio parameter of the slit plate is changed at different positions to achieve optimal airflow distribution. By adjusting this parameter locally, the system balances the cooling requirements of different stages without requiring uniform high airflow speeds throughout, thereby reducing overall energy consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution equalizes airflow speeds across semiconductor units, enhancing cooling efficiency and allowing for the selection of a smaller cooling fan, reducing energy consumption and manufacturing costs while simplifying unit structures and adaptations.
Implementation Method 1
cooling airflows which are generated by a cooling fan
Implementation Method 2
a slit plate...configured to limit an airflow speed of the cooling airflow
Data Source
AI summary
A semiconductor apparatus includes a housing in a shape of a panel, a cooling fan configured to exhaust from a top surface of the housing, and provided on the top surface, a partition plate configured to vertically partition a space below the cooling fan into a first space and a second space, and including opening portions through which a cooling airflow produced by the cooling fan passes from the first space to the second space, semiconductor units cooled by the cooling airflow, and vertically disposed in the first space, and a slit plate attached to at least one of the opening portions of the partition plate, and configured to limit an airflow speed of the cooling airflow.