Power Semiconductor Module Cooling Contact With Stress-Relief Channels

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Solution Overview

Problem

Conventional electronic modules with power semiconductors face challenges in integrating cooling elements that can also serve for electrical contacting, often resulting in inefficient heat dissipation and mechanical stress compensation.

Innovation Solution

The integration of a cooling element produced via additive manufacturing, arranged between the power semiconductor and the contacting arrangement, which provides electrical connection and forms channels for cooling media, with a design that offers flexibility to compensate for thermomechanical stresses and optimized stiffness based on application needs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional cooling elements are integrated into electronic modules, then heat dissipation is improved, but device complexity increases and manufacturing becomes more difficult

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidintegration complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the cooling element with the contacting arrangement into a single integrated component. The cooling element is formed as an integral part of the contacting arrangement through additive manufacturing, eliminating the need for separate cooling components and reducing assembly steps. This merging resolves the contradiction by maintaining effective heat dissipation while reducing device complexity and manufacturing difficulty.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The contacting arrangement is designed to perform multiple functions simultaneously: electrical contacting and heat dissipation. By integrating the cooling element into the contacting arrangement, a single component fulfills both electrical and thermal management functions, thereby improving heat dissipation efficiency without increasing device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If rigid cooling elements are used, then electrical contacting is improved, but thermomechanical stresses increase

Engineering Contradiction:

Improveelectrical contacting reliabilityVSAvoidthermomechanical stress

Core Design Contradiction:

ReliabilityVSStress or pressure

Solution Approach 1:

The patent changes the mechanical parameters of the cooling element by implementing a layered structure with varying rigidity. The cooling element has lower rigidity in the direction perpendicular to the power semiconductor surface compared to the parallel direction. This parameter change allows the cooling element to absorb thermomechanical stresses while maintaining sufficient electrical contacting reliability.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The cooling element incorporates flexible characteristics through its layered design, allowing it to deform and compensate for thermomechanical stresses. The structure includes channels that can expand and contract, providing flexibility perpendicular to the surface while maintaining electrical contact, thus reducing stress without compromising contacting reliability.

Inventive Principle:

Principle #30Flexible shells and thin films

3Ease of manufacture

If uniform stiffness is applied throughout the cooling element, then manufacturing is simplified, but application-specific optimization is reduced

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidapplication optimization

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent implements local quality by creating regions of different rigidity within the cooling element. The structure has varying stiffness characteristics in different directions and locations, with lower rigidity perpendicular to the surface and higher rigidity parallel to the surface. This local differentiation allows application-specific optimization while the additive manufacturing process maintains manufacturing feasibility.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The cooling element employs a composite layered structure with different material properties in different regions. The layered design allows for direction-dependent mechanical properties, creating a composite structure that is optimized for specific applications while remaining manufacturable through additive processes.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables efficient cooling and electrical contacting while reducing thermomechanical stresses, allowing for improved heat dissipation and mechanical stability of the power semiconductor, optimized for specific applications through direction-dependent stiffness and channel formation.

Implementation Method 1

the cooling element is thermally coupled to the power semiconductor via connection layers

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

the layers form a channel for guiding a cooling medium

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20240429124A1Electronic module comprising at least one power semiconductor, and method for producing same

Publication Date: 2024.12.26 ROBERT BOSCH GMBH

AI summary

An electronic module. The electronic module includes at least one power semiconductor electrically connected to a contacting arrangement, and at least one cooling element for at least indirectly cooling the at least one power semiconductor.