Semiconductor Module Cooling Layout for Low-Cost Temperature Sensing
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Solution Overview
Problem
Conventional semiconductor modules with built-in on-chip sensors are expensive, making it costly to monitor the temperature of all semiconductor elements, which affects the overall module cost and temperature control effectiveness.
Innovation Solution
A semiconductor module design featuring a cooler with parallel flow passages and a laminated substrate configuration where sensing chips and non-sensing chips are alternately positioned to coincide with the coolant flow direction, allowing for temperature detection without the need for expensive built-in sensors on all elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If built-in on-chip sensors are used for all semiconductor elements, then temperature monitoring precision is improved, but module cost increases
Solution Approach 1:
The patent applies partial action by installing temperature sensing chips on only one semiconductor element (either the IGBT chip or the free-wheeling diode chip, but not both), rather than equipping all semiconductor elements with sensors. This partial monitoring approach achieves acceptable temperature control while significantly reducing module cost compared to universal sensor installation.
2Reliability
If sensing chips are loaded on all semiconductor elements, then temperature detection reliability is improved, but device complexity increases
Solution Approach 1:
The patent segments the temperature monitoring function by separating sensing chip installation to only critical semiconductor elements. The cooler structure is also segmented into multiple flow passages (first, second, and third flow passages) that can be independently configured, allowing flexible temperature monitoring without requiring sensors on all elements, thus reducing overall device complexity.
3Ease of manufacture
If thermistors are used for temperature detection, then cost is reduced, but temperature monitoring precision deteriorates
Solution Approach 1:
The patent uses a sensing chip that copies the temperature detection function of more expensive built-in sensors but implements it in a separate, dedicated component rather than integrating it into all semiconductor elements. This external sensing chip approach provides better temperature monitoring precision than thermistors while avoiding the high cost of universal built-in sensor implementation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables effective temperature monitoring of semiconductor elements with a low-cost setup, improving temperature control by utilizing sensing chips to estimate the temperature of non-sensing chips, thus reducing overall module costs.
Implementation Method 1
a cooler (12) having a first flow passage (F1) and a second flow passage (F2) which are disposed in parallel by being isolated from each other, and a third flow passage (F3) for connecting the first flow passage (F1) and the second flow passage (F2)
Data Source
AI summary
A semiconductor module, including a cooler having first and second flow passages respectively formed on first and second sides of the semiconductor module that are opposite to each other, and a third flow passage connecting the first and second flow passages. The semiconductor module further includes a laminated substrate disposed on the cooler and having first to third circuit boards, a first sensing chip having a sensing function for detecting a temperature and a first non-sensing chip not having the sensing function, disposed on the first circuit board side by side along the third flow passage, and a second sensing chip having the sensing function and a second non-sensing chip not having the sensing function, disposed on the third circuit board side by side along the third flow passage. The first and second sensing chips are respectively disposed on the second side and the first side of the semiconductor module.