Semiconductor Module Cooling Unit Recess Design
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Solution Overview
Problem
Conventional semiconductor modules experience increased thermal resistance and reliability issues due to the use of compounds like grease for connecting semiconductor devices to coolers, and the melting point of resins limits the bonding temperature, affecting the reliability of the bonding between the semiconductor device and the cooler.
Innovation Solution
A semiconductor module design featuring a first cooling unit with a flow channel for refrigerant and a second cooling unit with a lower thermal conductivity, where the first cooling unit is fixed to the second cooling unit, and an insulating layer covers the semiconductor device, reducing thermal resistance and improving reliability by allowing for efficient heat dissipation without temperature limitations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a compound or grease is used to connect the semiconductor device and the cooler, then the bonding process is simplified, but the thermal resistance between the semiconductor device and the cooler increases
Solution Approach 1:
The patent removes the thermal interface material (compound or grease) from the bonding process entirely. Instead, it uses a cooler with a recess that directly receives the semiconductor device, creating direct thermal contact between the device and cooler without any intervening material that would increase thermal resistance.
Solution Approach 2:
The cooler is pre-formed with a recess during manufacturing that is specifically designed to accommodate the semiconductor device. This preliminary structuring eliminates the need for additional bonding materials and simplifies the assembly process while maintaining low thermal resistance through direct contact.
2Reliability
If the cooler is soldered after resin-sealing of the semiconductor device, then the bonding temperature is limited by the melting point of the resin, but the reliability of bonding between the semiconductor device and the cooler deteriorates
Solution Approach 1:
The patent divides the cooling system into separate components (cool器 with recess and semiconductor device) that are assembled before resin sealing. This segmentation allows the cooler to be structurally prepared in advance, enabling high-temperature soldering to occur before the resin is applied, thus avoiding the temperature limitation imposed by the resin's melting point.
Solution Approach 2:
The cooler's recess structure is pre-formed and the semiconductor device is positioned within it before resin sealing takes place. This preliminary assembly allows subsequent soldering operations to be performed at temperatures above the resin's melting point, ensuring reliable bonding without being constrained by the resin's thermal properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation efficiency and reliability by minimizing thermal resistance and eliminating temperature limitations during the bonding process, leading to improved performance and reduced production costs.
Implementation Method 1
a first cooling unit on which the cooling-target device is placed and that has a flow channel through which a refrigerant for cooling the cooling-target device flows
Implementation Method 2
a second cooling unit to which the first cooling unit is fixed and that has a flow channel coupled with the flow channel of the first cooling unit. The second cooling unit may have a lower thermal conductivity than that of the first cooling unit
Data Source
AI summary
A semiconductor module is provided, including: a cooling-target device; a first cooling unit on which the cooling-target device is placed and that has a flow channel through which a refrigerant for cooling the cooling-target device flows; and a second cooling unit to which the first cooling unit is fixed and that has a flow channel coupled with the flow channel of the first cooling unit. Also, a semiconductor module manufacturing method is provided, including: placing a cooling-target device on a first cooling unit that has a flow channel through which a refrigerant for cooling the cooling-target device flows; and fixing the first cooling unit to a second cooling unit that has a flow channel coupled with the flow channel of the first cooling unit.