Semiconductor Heat Dissipating Unit Embedded Copper for Thermal Stability

The patent applies local quality by embedding copper material specifically in the sealed region where the sealing member contacts the heat dissipating unit, while the primary part remains aluminum. This creates a localized material property change that matches the thermal expansion coefficient in the critical bonding area, preventing peeling without requiring the entire heat dissipating unit to be copper, thus maintaining weight reduction and cost benefits.

The patent uses composite materials by combining aluminum primary part with copper embedded part in a hybrid structure. The aluminum provides lightweight properties and cost effectiveness, while the copper embedded in the sealed region provides thermal expansion compatibility with the sealing member. This composite approach resolves the contradiction by integrating materials with complementary properties in a unified structure.

The patent applies local quality by placing copper material specifically in the sealed region where heat dissipation is critical and thermal expansion matching is needed, rather than using copper for the entire heat dissipating unit. This localized copper embedding provides improved heat dissipating characteristics in the critical area while maintaining the lightweight advantage of aluminum for the bulk structure.

The patent uses partial action by embedding copper only in the sealed region rather than using copper throughout the entire heat dissipating unit. This partial application of copper provides sufficient heat dissipating improvement in the critical bonding area while avoiding the excessive weight and cost that would result from full copper construction.