Semiconductor Cover Fastening via Locking Projection
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Solution Overview
Problem
Conventional semiconductor devices face issues with the cover detaching due to heat degradation when fixed with adhesive agents and poor workability during assembly when fixed with screws.
Innovation Solution
A semiconductor device design that uses a fastener with a through-hole in the cover and a projection in the case, where the fastener is attachable from the outside to lock the projection, ensuring secure mechanical fixation without heat-induced degradation and improving assembly efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive agent is used to fix the cover to the case, then the assembly process is simple, but the heat generated during operation degrades the bonded portion causing the cover to fall off
Solution Approach 1:
The patent replaces the chemical bonding system (adhesive agent) with a mechanical fastening system (fastener with locking structure). The fastener includes a locking protrusion that engages with a groove in the case, providing mechanical interlocking that is not degraded by heat. This substitution resolves the contradiction by maintaining assembly simplicity while eliminating the thermal degradation issue inherent in adhesive bonding.
2Reliability
If screws are used to fix the cover to the case, then the fixation reliability is improved, but the workability during assembly deteriorates
Solution Approach 1:
The fastener is segmented into distinct functional components: a insertion portion that fits through the through-hole, a locking protrusion that engages with the case groove, and a head portion for attachment. This segmentation allows the fastener to be inserted as a single piece and locked in one motion, eliminating the multi-step screw tightening process while maintaining secure fixation.
Solution Approach 2:
The fastener incorporates a self-locking mechanism where the locking protrusion automatically engages with the groove upon insertion. The elastic deformation of the fastener body during insertion causes the locking protrusion to snap into the groove, providing automatic locking without requiring separate tightening operations. This self-service feature improves assembly workability while ensuring reliable fixation.
3Reliability
If a fastener is used to mechanically fix the cover to the case, then the durability against high temperatures is improved, but the device complexity increases
Solution Approach 1:
The fastener is designed as a universal component that combines multiple functions: it provides mechanical fastening through the through-hole, thermal isolation by preventing direct metal-to-metal contact between cover and case, and structural alignment through its geometric fit. This multi-functionality allows a single component to address multiple requirements, reducing overall device complexity while maintaining thermal durability.
Data Source
AI summary
It is an object of the present invention to provide an easily assemblable semiconductor device including a cover that covers a top of a case and is reliably fixed to the case defining an outline of the semiconductor device. A semiconductor device according to the present invention includes: a case defining an outline of the semiconductor device; a cover covering a top of the case; and a fastener mechanically fixing the cover to the case, a through-hole is formed in the cover, the case includes a projection inserted into the through-hole, and the fastener is attachable to the projection inserted into the through-hole of the cover from the outside of the cover and locks the projection upon the attachment to prevent the projection from falling off the through-hole.