Semiconductor Cover Frame for Detachable Glass Removal

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Solution Overview

Problem

Existing semiconductor devices face challenges in easily removing the cover glass without breaking it, leading to potential defects and issues like ghosting and flare due to the adhesive strength of the cover glass, which is not well-defined in current technologies.

Innovation Solution

A semiconductor device with a frame structure that includes a frame supporting the cover member, featuring a cover fixing portion and retaining portions to detachably hold the cover member, allowing for easy removal without damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the cover glass is fixed with adhesive to tightly cover the opening portion, then the handleability of the semiconductor device is improved and foreign matter is prevented from entering, but the cover glass becomes difficult to remove and may break during removal

Engineering Contradiction:
Improveprotection of semiconductor deviceVSAvoidremoval of cover glass
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The frame is divided into a frame main body portion and a detachable cover holding portion. The cover holding portion can be separated from the frame main body portion, allowing the cover glass to be removed without breaking it. This segmentation enables the cover glass to be securely held during normal operation while allowing easy removal when needed.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The cover holding portion is designed to be detachable from the frame main body portion, transforming the static fixed structure into a dynamic one. This allows the cover glass to be easily removed by detaching the cover holding portion, solving the problem of difficult removal while maintaining secure attachment during use.

Inventive Principle:
Principle #15Dynamics

2Strength

If the adhesive strength is increased to prevent separation during handling, then the cover glass remains securely attached, but the cover glass may break during removal and cause imaging defects

Engineering Contradiction:
Improveadhesive strengthVSAvoidintegrity of cover glass
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

By segmenting the frame into a frame main body portion and a detachable cover holding portion, the invention eliminates the need for strong adhesive bonding that could cause glass breakage. The cover holding portion securely holds the cover glass without requiring excessive adhesive strength, preventing both separation during handling and breakage during removal.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The cover holding portion acts as an intermediary between the frame main body portion and the cover glass. It provides a secure attachment mechanism that holds the cover glass firmly during normal operation but allows easy removal without causing the glass to break, thus mediating between the need for strong attachment and the risk of breakage.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of operation

If the cover glass is removed by forcibly peeling off the bonding portion, then the cover glass can be removed, but the housing or cover glass may break

Engineering Contradiction:
Improveremoval of cover glassVSAvoidintegrity of housing and cover glass
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The frame is segmented into a frame main body portion and a detachable cover holding portion. This segmentation allows the cover glass to be removed by simply detaching the cover holding portion from the frame main body portion, eliminating the need for forcible peeling that could cause breakage of the housing or cover glass.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The detachable cover holding portion transforms the static bonded structure into a dynamic one that can be easily assembled and disassembled. This dynamic design allows the cover glass to be removed without forcible peeling, preventing damage to both the housing and cover glass while maintaining ease of operation.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS20260011612A1Semiconductor device and electronic device
Publication Date: 2026.01.08 SONY SEMICON SOLUTIONS CORP
  • US20260011612A1 patent drawing
  • US20260011612A1 patent drawing
  • US20260011612A1 patent drawing

AI summary

A semiconductor device enables obtainment of an attachment state of a cover member in order to obtain good handleability and to prevent foreign matter from entering the inside of a package, and enables the cover member to be easily removed in order to solve problems such as ghost and flare caused by the presence of the cover member. The semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a cover member covering the semiconductor element from above; a frame supporting the cover member relative to the substrate; and a cover holding portion detachably holding the cover member relative to at least a part of the frame.