Semiconductor Package Cover Structure for Chip Heat Dissipation

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Solution Overview

Problem

Semiconductor devices face challenges in effectively managing heat generation, leading to increased temperatures and potential erroneous operations due to inadequate heat release performance.

Innovation Solution

A semiconductor device design incorporating a heat release sheet covering the semiconductor chip and a cover member with a bonding mechanism that enhances heat conductivity, where the heat release sheet is fixed to the cover member through a bonding member, ensuring direct contact and efficient heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If power consumption is increased to achieve sophisticated functions, then functional capability is improved, but heat generation increases leading to temperature rise

Engineering Contradiction:

Improvefunctional capabilityVSAvoidsemiconductor chip temperature

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

A heat release sheet is introduced as an intermediary component between the semiconductor chip and the cover member. This heat release sheet has high heat conductivity and is in direct contact with the semiconductor chip, serving as a mediator to efficiently transfer heat from the chip to the cover member, thereby resolving the temperature rise issue while maintaining high power consumption for sophisticated functions

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The bonding member is designed with specific material properties including heat conductivity of 0.3 W/mK or higher, and is configured to be in direct contact with both the semiconductor chip and the cover member. By changing the thermal parameters of the bonding structure, the heat release efficiency is improved, allowing the system to maintain higher power consumption without excessive temperature rise

Inventive Principle:

Principle #35Parameter changes

2Strength

If a bonding member is placed between the heat release sheet and cover member, then fixation is achieved, but heat conduction path may be interrupted

Engineering Contradiction:

Improvebonding strengthVSAvoidheat conduction reliability

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The bonding member is selected with specific material parameters including heat conductivity of 0.3 W/mK or higher, ensuring that while it provides adequate bonding strength to fix the heat release sheet to the cover member, it maintains sufficient thermal conductivity to keep the heat conduction path reliable and continuous

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The bonding member is designed as a composite structure that combines adhesive properties for strong bonding with thermally conductive properties for efficient heat transfer. This composite approach allows simultaneous achievement of fixation strength and heat conduction reliability

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design improves heat release efficiency, reducing semiconductor chip temperature and preventing erroneous operations by ensuring effective heat dissipation from the chip to the cover member.

Implementation Method 1

a heat release sheet arranged on the semiconductor chip to cover the entire semiconductor chip... The cover member has a first portion facing the semiconductor chip... the heat release sheet is bonded and fixed to the cover member through a second bonding member partially arranged between the heat release sheet and the cover member

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

the heat release sheet is bonded and fixed to the cover member through a second bonding member partially arranged between the heat release sheet and the cover member

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS12148680B2Semiconductor device and method of manufacturing the same

Publication Date: 2024.11.19 RENESAS ELECTRONICS CORP

AI summary

A semiconductor device includes: a wiring substrate; a semiconductor chip mounted on the wiring substrate; a heat release sheet arranged on the semiconductor chip to cover the entire semiconductor chip and having a larger area than an area of the semiconductor chip; and a cover member which covers the semiconductor chip and the heat release sheet and to which the heat release sheet is fixed. The cover member has a first portion facing the semiconductor chip, a flange portion arranged in a periphery of the first portion and bonded and fixed onto the wiring substrate, and a second portion arranged between the first portion and the flange portion. In a plan view of the cover member viewed from the heat release sheet, the heat release sheet is bonded/fixed to the cover member through a bonding member partially arranged between the heat release sheet and the cover member.