Semiconductor Package Cover With Opaque Periphery
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Solution Overview
Problem
Conventional semiconductor packages with transparent covers suffer from light flaring or scattering, which negatively impacts the performance of image sensor chips.
Innovation Solution
A semiconductor package design featuring a cover with an opaque region around its periphery, preventing light flaring or scattering, while allowing light to reach the sensor region, and including a primary and secondary cover structure with an adhesive to form a sealed cavity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a transparent cover is used to protect the sensor from the environment, then the sensor is protected and light can reach the sensor area, but light flaring or scattering occurs which negatively impacts sensor performance
Solution Approach 1:
The cover structure is divided into different regions with different optical properties: the first cover portion remains transparent to allow light transmission to the sensor, while the second cover portion is configured to block or absorb light to prevent flaring and scattering. This local differentiation of optical properties resolves the contradiction between protection and light quality.
Solution Approach 2:
The cover is segmented into functionally distinct portions: a first cover portion that transmits light and a second cover portion that blocks light. This segmentation allows each portion to perform its specific function optimally, preventing light scattering while maintaining sensor protection and light transmission capabilities.
2Manufacturing precision
If a cover structure is added to prevent light flaring or scattering, then light quality improves, but the device complexity increases
Solution Approach 1:
The light-blocking function is merged into the cover structure itself through the second cover portion, rather than adding a separate light-blocking component. This integration achieves light scattering control while minimizing the increase in device complexity, as the cover serves both protective and optical control functions.
Solution Approach 2:
The cover structure is designed to perform multiple functions: protecting the sensor from environmental damage, transmitting light to the sensor area, and blocking stray light to prevent flaring. By making the cover multi-functional, the design achieves light scattering control without requiring additional dedicated components, thus limiting complexity increase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The opaque region effectively reduces light scattering, enhancing the performance of semiconductor sensor packages by ensuring that light reaches the sensor region without interference.
Implementation Method 1
The cover includes an opaque region disposed at a periphery of the bottom major cover surface of the cover. The opaque region is configured to prevent flaring or scattering of light.
Data Source
AI summary
A semiconductor package is disclosed. The package includes a package substrate having top and bottom major package substrate surfaces, the top major package surface including a die region. A die having first and second major die surfaces is attached onto the die region. The second major die surface is attached to the die region. The first major die surface includes a sensor region and a cover adhesive region surrounding the sensor region. The package also includes a cover adhesive to the cover adhesive region on the first major die surface. A protective cover with first and second major cover surfaces and side surfaces is attached to the die using the cover adhesive. The second major cover surface contacts the cover adhesive. The protective cover covers the sensor region. The protective cover includes a cover attached to the first major die surface, the cover includes top and bottom major cover surfaces and side cover surfaces. The cover includes an opaque region disposed at a periphery of the bottom cover surface of the cover, the opaque region is configured to prevent flaring or scattering of light. An encapsulant is disposed on the package substrate to cover exposed portions of the package substrate, die and bond wires and side surfaces of the cover, while leaving the first major cover surface exposed.