Semiconductor Package Cover With V-Grooves for Multi-Size Cases
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Solution Overview
Problem
The high manufacturing cost of semiconductor devices is due to the need for multiple molds to accommodate different case sizes, leading to increased costs for cover production and inventory management.
Innovation Solution
A semiconductor device design featuring a cover with V-shaped grooves that can be easily divided to fit various case sizes, eliminating the need for multiple molds and allowing for standardized cover production, which reduces manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If covers are individually prepared for each case size, then the cover fits the case perfectly, but the manufacturing cost increases due to multiple molds being required
Solution Approach 1:
A single standardized cover mold design is used to produce covers for multiple case sizes. The cover is designed with a standardized shape and dimensions that can accommodate different case sizes through selective cutting along V-shaped grooves, eliminating the need for multiple dedicated molds for each case size variant.
Solution Approach 2:
The standardized cover is designed with V-shaped grooves that allow it to be divided into multiple sections. By cutting the cover along these grooves, the same standardized cover can be adapted to fit different case sizes, enabling one mold to serve multiple product specifications.
2Adaptability or versatility
If multiple types of covers are prepared for different case sizes, then each case size has a suitable cover, but inventory control complexity increases
Solution Approach 1:
The inventory is simplified to primarily one type of standardized cover. This single cover type can be adapted to multiple case sizes through the V-shaped groove cutting method, reducing inventory complexity while maintaining versatility across different product specifications.
Solution Approach 2:
The standardized cover includes pre-designed V-shaped grooves that enable easy division into different sizes. This segmentation feature allows a single inventory item to serve multiple purposes, reducing the number of SKUs needed in inventory while maintaining adaptability to various case dimensions.
3Manufacturing precision
If multiple molds are used for different cover sizes, then each cover type is optimized for its case size, but the manufacturing process becomes more complex
Solution Approach 1:
One standardized cover mold is designed to produce covers that can fit multiple case sizes. The mold creates a universal cover shape with V-shaped grooves that can be cut to accommodate different dimensions, eliminating the need to design and maintain multiple specialized molds for each case size.
Solution Approach 2:
The standardized cover from the single mold includes V-shaped grooves positioned to allow easy division into different size configurations. This enables one mold to effectively produce covers for multiple case sizes through subsequent cutting operations, reducing mold complexity while maintaining size precision.
Data Source
AI summary
A semiconductor device includes: an insulating resin; a metal pattern provided on the insulating resin; a semiconductor chip jointed to the metal pattern; a case bonded on the insulating resin and surrounding the semiconductor chip; a sealing material sealing the semiconductor chip inside the case; and a cover provided on an upper part of the case and covering the semiconductor chip and the sealing material, wherein a groove having a V-shaped cross-section is provided on the cover.