Semiconductor Sealing Structure for Wafer Cutting Crack Blocking

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Solution Overview

Problem

Cracks generated during the cutting of wafers can extend into semiconductor chips, leading to chip failure due to the lack of effective protection in existing manufacturing processes.

Innovation Solution

A semiconductor structure is designed with a sealing structure that includes a metal wall body and a blocking wall body disposed around the chip, where the blocking wall body is placed on top of the metal wall body to prevent cracks from extending into the chip, using a substrate with interlayer dielectric and etching stop layers for protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a chip is cut from a wafer using conventional methods, then the chip can be separated and packaged, but cracks are generated during cutting that extend into the chip causing failure

Engineering Contradiction:

Improvechip separation efficiencyVSAvoidchip integrity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent applies preliminary action by forming a protective structure (sealing structure with metal wall body and blocking wall body) around the chip before the cutting process. This protective structure is prepared in advance to prevent cracks from extending into the chip during the subsequent cutting operation, thus maintaining chip integrity while enabling efficient separation.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent uses an intermediary approach by introducing a sealing structure as a mediator between the cutting process and the chip. This sealing structure, comprising a metal wall body and a blocking wall body, acts as a protective barrier that intercepts and blocks crack propagation, preventing direct damage to the chip during wafer cutting.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If the wafer is cut without protective structures, then the cutting process is simple and fast, but cracks propagate freely into the chip leading to failure

Engineering Contradiction:

Improvecutting process simplicityVSAvoidcrack propagation

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent converts the harmful effect of crack propagation into a beneficial outcome by designing a blocking wall body that specifically targets and intercepts cracks. The blocking wall body is positioned and structured to convert the potentially destructive crack energy into a controlled path that does not reach the chip, thus transforming the harm into a protective mechanism.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent employs composite materials by combining different materials with complementary properties: a metal wall body (providing structural strength and sealing) and a blocking wall body (providing crack propagation resistance). This composite sealing structure leverages the advantages of each material to simultaneously maintain manufacturing simplicity while preventing crack propagation.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS12191263B2Semiconductor structure and manufacturing method of semiconductor structure

Publication Date: 2025.01.07 CHANGXIN MEMORY TECH INC

AI summary

A semiconductor structure includes a chip structure and a sealing structure disposed on a substrate of the semiconductor structure. The sealing structure includes a metal wall body and a blocking wall body located on a top of the metal wall body, and the metal wall body and the blocking wall body both are disposed around the chip structure.