3D Crack Detection Structure in Semiconductor Devices
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Solution Overview
Problem
Semiconductor devices face challenges in detecting cracks accurately during the sawing and packaging processes, leading to the shipment of defective products.
Innovation Solution
A semiconductor device with a three-dimensional crack detection structure that includes a net-type pattern with vertical and horizontal patterns, connected by upper and lower horizontal patterns, which detects cracks by analyzing changes in electrical resistance and delay in output current when a crack penetrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a simple crack detection structure is used, then the device complexity is reduced, but the measurement precision of crack detection deteriorates
Solution Approach 1:
The patent transitions from planar two-dimensional crack detection patterns to three-dimensional detection structures that extend vertically through multiple layers. The CDS includes conductors arranged in three dimensions with varying heights, allowing detection of cracks in multiple spatial directions simultaneously, thereby improving detection precision without proportionally increasing complexity
Solution Approach 2:
The crack detection structure is divided into multiple segmented components including first conductors, second conductors, third conductors, and fourth conductors arranged in different spatial configurations. Each segment serves a specific detection function for different crack orientations and depths, enabling comprehensive crack detection through coordinated operation of segmented elements
2Reliability
If a three-dimensional crack detection structure is implemented, then the crack detection power is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent forms the three-dimensional crack detection structure during the semiconductor manufacturing process before final device assembly. Conductors are deposited and patterned in predetermined three-dimensional configurations using standard fabrication techniques, establishing the detection geometry in advance while maintaining manufacturing feasibility and precision requirements within conventional limits
3Measurement precision
If multiple patterns are used to detect crack direction, then the measurement precision of crack orientation is improved, but the device complexity increases
Solution Approach 1:
The three-dimensional crack detection structure serves multiple detection functions simultaneously - detecting crack presence, determining crack orientation, and assessing crack depth. The same set of conductors in three-dimensional arrangement performs all these functions through unified measurement protocols, avoiding the need for separate dedicated structures for each detection task and thereby managing complexity efficiently
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances crack detection power by distinguishing between cracks and nano-cracks, preventing defective semiconductor devices from being shipped by accurately identifying crack penetration and direction.
Implementation Method 1
detects cracks by analyzing changes in electrical resistance
Data Source
AI summary
A semiconductor device including a substrate including a central region and a peripheral region surrounding the central region, a semiconductor integrated circuit in the central region, and a three-dimensional crack detection structure in the peripheral region, the three-dimensional crack detection structure surrounding the central region, the three-dimensional crack detection structure including a first pattern, a second pattern, and a third pattern, the first and second patterns extending in a first direction and spaced apart from each other, the third pattern being parallel to an upper surface of the substrate and connecting the first and second patterns to each other, the third pattern including a first portion and a second portion, the first and second portions extending in a second direction and a third direction respectively, the second direction intersecting with the first direction, the third direction intersecting with the first and second directions may be provided.