Semiconductor Crack Detection via Integrated Capacitor Structures
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Solution Overview
Problem
Semiconductor devices face challenges in detecting cracks during production and operation, which affects their quality, yield, and reliability.
Innovation Solution
A semiconductor device with a crack-detecting structure comprising a capacitor unit and switch unit integrated into the substrate, along with stress-dissipating and guard structures, allows for electrical detection of cracks, improving manufacturing efficiency and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional visual inspection methods are used to detect cracks, then inspection can be performed, but inspection costs are high and sorting consistency is poor
Solution Approach 1:
The patent replaces manual visual inspection with an electrical detection system using capacitor structures integrated into the semiconductor device. The capacitor detects cracks through electrical property changes (capacitance variation) rather than mechanical/optical inspection, eliminating the need for expensive manual sorting while improving detection accuracy and consistency.
Solution Approach 2:
The semiconductor device performs self-detection of cracks through integrated capacitor structures that automatically sense structural integrity changes. The device's own electrical characteristics are used to detect cracks, eliminating the need for external inspection equipment and reducing manufacturing costs.
2Reliability
If capacitor structures are integrated into the substrate for crack detection, then crack detection capability is improved, but device complexity increases
Solution Approach 1:
The patent merges the crack detection function with existing semiconductor device structures by integrating capacitor structures directly into the substrate. The capacitor shares physical space and manufacturing processes with other device components, adding detection capability without proportionally increasing overall device complexity.
Solution Approach 2:
The capacitor structure serves multiple functions: it acts as both a functional electronic component and a crack detection sensor. This multi-functionality allows the same structure to contribute to device operation while simultaneously providing structural integrity monitoring, reducing the need for separate dedicated detection structures.
Data Source
AI summary
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate and a first crack-detecting structure positioned in the substrate and comprising a first capacitor unit. The first capacitor unit comprises a first bottom conductive layer positioned in the substrate, a first capacitor insulating layer surrounding the first bottom conductive layer, and a first buried plate surrounding the first capacitor insulating layer.