Semiconductor Chip Crack Detection Using Elastic Wave Sensors
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Solution Overview
Problem
In semiconductor manufacturing, the thinness of chips makes them prone to cracking due to accumulated loads from foreign matter, leading to inaccurate detection and increased defective product rates, as existing inspection methods struggle with contrast differences and complex device setups.
Innovation Solution
A semiconductor manufacturing device equipped with a pick-up device, die-bonding device, and detectors that use piezoelectric elements to detect elastic waves generated by semiconductor chips, allowing for real-time crack detection and prevention by monitoring elastic energy during chip mounting and transfer processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If appearance observation inspection using magnification observation and recognition camera is used to detect cracks, then crack detection is performed, but contrast difference becomes small between crack and periphery portion when resin layer is formed, making accurate inspection difficult
Solution Approach 1:
The patent replaces optical inspection methods with acoustic wave-based detection. Instead of using recognition cameras and optical contrast, the system uses piezoelectric elements to generate and detect elastic waves that interact with cracks, substituting optical measurement with acoustic measurement to overcome the contrast problem
Solution Approach 2:
The patent changes the detection parameter from optical contrast to acoustic wave characteristics. By measuring changes in elastic wave propagation (time, amplitude, frequency) rather than optical reflectivity, the system detects cracks regardless of surface resin layers that mask optical contrast
2Measurement precision
If infrared light is irradiated from rear surface side to detect cracks, then crack detection is performed, but contrast difference becomes small when adhering layer is formed on rear surface, and device structure becomes complicated
Solution Approach 1:
The patent replaces infrared optical inspection with acoustic wave-based detection using piezoelectric elements. This substitution eliminates the need for complex infrared irradiation facilities and achieves crack detection through elastic wave propagation, simplifying the overall device structure
Solution Approach 2:
The patent uses elastic waves as an intermediary to detect cracks. The piezoelectric elements generate elastic waves that propagate through the semiconductor chip, and the interaction of these waves with cracks provides detection information, serving as an effective mediator between the detection system and the crack defect
3Productivity
If crack detection is delayed until finished product inspection, then manufacturing process continues, but defective products are produced and manufacturing cost increases
Solution Approach 1:
The patent performs crack detection at an early stage in the manufacturing process, before final packaging and shipping. By integrating piezoelectric element-based detection into the manufacturing flow, the system identifies cracked chips early, allowing defective products to be prevented before they reach the customer
Solution Approach 2:
The patent implements a feedback mechanism where detection results from piezoelectric elements are immediately used to identify and remove cracked semiconductor chips from production. This real-time feedback loop ensures that defective products are prevented while maintaining manufacturing flow efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and timely detection of cracks, preventing defective products and reducing manufacturing costs by stopping the production line when cracks are detected, thus improving yield and simplifying the identification of defect causes.
Implementation Method 1
a detector that detects an elastic wave from the semiconductor chip
Data Source
AI summary
According to one embodiment, a semiconductor manufacturing device includes a first stage, a second stage, a transfer unit, and a detector. The first stage corrects a position of the semiconductor chip. The second stage supports an object into which the semiconductor chip is to be installed. The transfer unit transfers the semiconductor chip picked up from the first stage to the second stage. The detector detects an elastic wave from the semiconductor chip. The detector is attached to at least one of the first stage and the second stage.