Semiconductor Substrate Crack Detection via Attuned Indenter
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Solution Overview
Problem
Existing methods for testing semiconductor substrates during or after fabrication are inefficient, as they can cause mechanical failures like cracks due to excessive force, leading to electrical failures and increased costs, necessitating a more effective examination system.
Innovation Solution
A system comprising an indenter and a piezoelectric acoustic emission sensor, where the indenter is attuned to the sensor's resonance frequencies, applies a controlled force to induce a crack and detect acoustic signals, using attaching means like hard glue or mechanical fixing to transmit signals effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a test pin exerts force onto the semiconductor substrate to establish electrical connection, then electrical testing can be performed, but mechanical failure such as cracks may occur leading to electrical failure
Solution Approach 1:
The patent applies preliminary action by performing acoustic emission testing before electrical testing to detect pre-existing cracks. The system uses an indenter to apply controlled force and acoustic sensors to detect cracks before the electrical test pin contacts the substrate, preventing subsequent mechanical failure during electrical testing.
Solution Approach 2:
The patent replaces direct mechanical contact testing with acoustic emission detection. Instead of relying solely on mechanical force application to test electrical connections, the system uses acoustic sensors to detect mechanical stress and crack formation, substituting mechanical testing with acoustic field-based detection.
2Reliability
If cracks are checked before substrate delivery using traditional methods, then substrate integrity can be verified, but the inspection process becomes time consuming and increases fabrication costs
Solution Approach 1:
The patent merges the crack detection function with the electrical testing process. The acoustic emission sensor is integrated into the electrical test probe, allowing simultaneous mechanical stress application and acoustic crack detection during the same operation, eliminating the need for separate inspection steps.
Solution Approach 2:
The patent enables continuous crack detection throughout the electrical testing process. The acoustic emission monitoring operates continuously during force application, providing real-time feedback on substrate integrity without interrupting the testing workflow, thereby maintaining high productivity while ensuring reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for sensitive detection of cracks, reducing the risk of electrical failures and streamlining the inspection process, enabling real-time verification of substrate integrity during electrical testing without subsequent dedicated inspections.
Implementation Method 1
a piezoelectric acoustic emission sensor configured to detect an acoustic signal emitted by the crack
Implementation Method 2
wherein the resonance frequencies of the indenter and the piezoelectric acoustic emission sensor are attuned to one another
Data Source
AI summary
A system for examining semiconductor substrates may comprise an indenter configured to exercise a force onto the semiconductor substrate such that a crack in the semiconductor substrate occurs, a piezoelectric acoustic emission sensor configured to detect an acoustic signal emitted by the crack, and attaching means configured to fasten the indenter to a first surface of the piezoelectric acoustic emission sensor. The indenter and the attaching means are configured to transmit the acoustic signal to the piezoelectric acoustic emission sensor. The resonance frequencies of the indenter and the piezoelectric acoustic emission sensor are attuned to one another.