Semiconductor Crack Sensor Layout for Dicing-Induced Chip Fractures
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Solution Overview
Problem
During the dicing process of semiconductor wafers, cracks can occur in semiconductor chips due to stress variations, leading to malfunction or failure, and there is a need for effective crack detection methods.
Innovation Solution
A semiconductor device with a crack sensor system that includes conductive patterns and resistors connected in parallel, disposed on the substrate, which detects cracks by measuring resistance changes as they propagate, allowing for early identification of crack occurrence and propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If dicing is performed to separate semiconductor chips from the wafer, then productivity is improved by obtaining individual chips, but cracks may occur in the chips due to stress variations during the process
Solution Approach 1:
A crack sensor is constructed in advance within the semiconductor chip structure, comprising a conductive pattern arranged in a specific geometry (such as a meander or spiral pattern) that is formed during the chip fabrication process. This sensor is prepared beforehand to detect cracks that may occur during subsequent dicing and handling operations, allowing for real-time monitoring of chip integrity throughout the manufacturing and packaging process.
2Reliability
If a crack sensor is introduced to detect cracks in the semiconductor chip, then reliability is improved by enabling crack detection, but device complexity increases due to the additional sensor structure
Solution Approach 1:
The conductive pattern serving as the crack sensor is designed to perform multiple functions: it acts as both an electrical conductor for signal transmission and a mechanical stress indicator through its resistance changes. The same conductive structure that is part of the chip's electrical interconnection system also serves as the sensing element, eliminating the need for completely separate sensor components and reducing overall device complexity.
Solution Approach 2:
The crack detection mechanism relies on monitoring changes in electrical resistance of the conductive pattern. When a crack occurs in the semiconductor substrate, it causes mechanical deformation and stress concentration that alters the resistance value of the conductive pattern. By measuring these resistance parameter changes, the system can detect crack occurrence and propagation without requiring complex sensor structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The crack sensor effectively detects and monitors crack propagation, enabling timely intervention to prevent chip failure by measuring resistance changes across the resistors, providing a means to determine the extent and location of cracks.
Implementation Method 1
a plurality of resistors substantially penetrating the target layer, the plurality of resistors connected in parallel to each other through the first conductive pattern and the second conductive pattern
Data Source
AI summary
A semiconductor device includes a target layer disposed on a substrate, and a crack sensor for detecting a crack generated in the target layer. The crack sensor includes a first conductive pattern positioned at a bottom surface of the target layer, a second conductive pattern positioned on a top surface of the target layer, the top surface being opposite to the bottom surface of the target layer, a plurality of resistors, and nodes. The plurality of resistors are connected in parallel to each other through the first conductive pattern and the second conductive pattern. Each of the plurality of resistors is disposed to substantially penetrate the target layer.