Semiconductor Crack Sensor Integration for Reliability
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Solution Overview
Problem
Semiconductor components are prone to cracks during production and operation, which can lead to defects due to mechanical strain and thermal expansion differences, necessitating a method to detect and prevent crack propagation.
Innovation Solution
Integration of a crack sensor within the semiconductor body that extends into the component, allowing for detection of cracks by measuring changes in electrical resistance or leakage current, with the sensor's position ensuring it can detect cracks distant from the top side and positioned closer to the bottom side than the component's thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a crack sensor is integrated into the semiconductor body, then crack detection capability is improved, but device complexity increases
Solution Approach 1:
The crack sensor is merged with the semiconductor body by integrating the sensor structure directly into the semiconductor manufacturing process. The sensor extends into the semiconductor body with its bottom positioned at a distance less than the full thickness from the bottom side, allowing crack detection while maintaining a unified structure rather than adding separate external sensing components.
2Reliability
If the crack sensor extends deep into the semiconductor body, then detection coverage is improved, but manufacturing precision requirements increase
Solution Approach 1:
The crack sensor is prepared and positioned in advance during the semiconductor manufacturing process, before the final component assembly. The sensor is integrated into the semiconductor body with predetermined positioning, where the bottom of the sensor is positioned at a specific distance from the bottom side that is less than the full thickness, ensuring optimal detection coverage without requiring post-manufacturing adjustment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables early detection of cracks, allowing for proactive measures such as disabling or replacing defective components, thereby preventing functional failures and ensuring reliability.
Implementation Method 1
allowing for detection of cracks by measuring changes in electrical resistance or leakage current
Data Source
AI summary
A first embodiment relates to a semiconductor component. The semiconductor component has a semiconductor body with a bottom side and a top side spaced distant from the bottom side in a vertical direction. In the vertical direction, the semiconductor body has a certain thickness. The semiconductor component further has a crack sensor configured to detect a crack in the semiconductor body. The crack sensor extends into the semiconductor body. A distance between the crack sensor and the bottom side is less than the thickness of the semiconductor body.