Semiconductor Chip Crack Stop with Corner Projections
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Solution Overview
Problem
Conventional semiconductor chip dicing processes introduce microscopic fractures at corners due to mechanical stresses, which can propagate and damage the delicate circuit structures when thermal and mechanical stresses are applied, and existing crack stops are ineffective in controlling crack propagation.
Innovation Solution
The formation of a crack stop in the semiconductor substrate with multiple projections extending to the edges of the corners to fence off and isolate the corner regions, preventing crack propagation into the central active circuit area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional crack stop is used that does not extend to the edges of the die, then the manufacturing process is simpler, but cracks can achieve significant length before encountering the crack stop and become uncontrollable
Solution Approach 1:
The crack stop is segmented into multiple projections that extend to the edges of the die, creating multiple barriers along the perimeter. This segmentation allows the crack stop to intercept cracks at multiple points around the corner regions, preventing crack propagation into the active area while maintaining a manageable structural complexity through modular positioning of the projections.
Solution Approach 2:
The crack stop features are localized specifically at the corner regions where cracks are most likely to initiate and propagate. By concentrating the crack stop projections at these critical locations rather than uniformly distributing them across the entire die perimeter, the design achieves effective crack prevention with minimized overall complexity.
2Reliability
If the crack stop extends to the edges of the die, then crack propagation is prevented more effectively, but the manufacturing precision requirements increase
Solution Approach 1:
The crack stop projections are formed as part of the semiconductor substrate fabrication process itself, integrating the crack stop structure creation into the preliminary manufacturing steps. This preliminary formation ensures proper alignment with the die edges is achieved during the standard fabrication sequence, avoiding the need for separate high-precision alignment operations that would increase manufacturing complexity.
Data Source
AI summary
Various semiconductor chip crack stops and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor substrate that has a first corner defined by a first edge and a second edge. A crack stop is formed in the semiconductor substrate. The crack stop includes a first projection extending to the first edge and a second projection extending to the second edge to fence off a portion of the semiconductor substrate that includes the first corner.