Semiconductor Layer Structure With CSC Overlap for RBSOA Stability

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Solution Overview

Problem

Existing semiconductor devices, such as IGBTs, experience variations in junction depth and concentration between the base layer and carrier stored layer, leading to reduced reverse bias safe operating area (RBSOA) and breakdown tolerance.

Innovation Solution

Incorporation of a p-type carrier storage control (CSC) layer in the semiconductor device, designed to overlap with the base and carrier stored layers, stabilizing the junctions by controlling impurity concentration profiles.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If impurity peak concentration of the p-type base layer and n-type carrier stored layer is stabilized, then threshold voltage variation is reduced, but junction depth and concentration variation between base layer and carrier stored layer occurs

Engineering Contradiction:
Improvethreshold voltage stabilityVSAvoidjunction depth and concentration variation
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

A CSC layer is introduced as an intermediary between the base layer and carrier stored layer. This layer mediates the interaction between the two layers by providing a controlled impurity concentration profile that prevents direct junction variations, thereby resolving the contradiction between threshold voltage stability and junction precision

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If impurity concentration is low in junction regions, then current can be cut off, but breakdown tolerance is lowered

Engineering Contradiction:
Improvecurrent cutoff capabilityVSAvoidbreakdown tolerance
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The CSC layer implements local quality by having different impurity concentration characteristics in different regions. The layer provides low impurity concentration at the junction interface for current cutoff while maintaining higher breakdown tolerance in other regions through its specific concentration profile

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20250240992A1Semiconductor device, and method of manufacturing semiconductor device
Publication Date: 2025.07.24 MITSUBISHI ELECTRIC CORP
  • US20250240992A1 patent drawing
  • US20250240992A1 patent drawing
  • US20250240992A1 patent drawing

AI summary

A semiconductor device includes a source layer of a first conductivity type located in a surface portion of a semiconductor layer and defined by a concentration profile of a first impurity, a base layer of a second conductivity type located on a lower side of the source layer and defined by a concentration profile of a second impurity, a carrier stored layer of the first conductivity type located on a lower side of the base layer and defined by a concentration profile of a third impurity, a drift layer of the first conductivity type located on a lower side of the carrier stored layer, and a CSC layer of the second conductivity type defined by a concentration profile of a fourth impurity. A region containing the fourth impurity includes a region where a region containing the second impurity and a region containing the third impurity overlap each other.