Semiconductor Module Curved Thermal Interface
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Solution Overview
Problem
Existing semiconductor assemblies face challenges in achieving a form-fitting mechanical/thermal connection between semiconductor elements and heat sinks due to differing thermal expansion coefficients, leading to deformations and inefficient heat dissipation, which are costly and complex to mitigate.
Innovation Solution
A semiconductor assembly with a semiconductor element having convex or concave curvatures on its surface, matched by corresponding curvatures on the heat sink, allowing for a positive mechanical/thermal connection over thermally relevant surfaces, with a deviation of radii of up to 10% to ensure effective heat dissipation and quality verification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldered or sintered connections are used to electrically connect semiconductor elements to substrates, then electrical contact is achieved, but significant deformations occur due to thermal expansion differences
Solution Approach 1:
The patent applies parameter changes by modifying the temperature parameter during the joining process. Specifically, the semiconductor element is heated to a predetermined temperature before being connected to the substrate, which compensates for thermal expansion differences and prevents deformations. This temperature parameter adjustment ensures both reliable electrical contact and manufacturing precision.
2Manufacturing precision
If complex measures such as compensating layers are used to mitigate deformations, then manufacturing precision improves, but device complexity and cost increase
Solution Approach 1:
Instead of adding complex structural elements like compensating layers, the patent uses parameter changes by controlling the temperature during the joining process. This simplifies the device structure while maintaining manufacturing precision, as the temperature adjustment alone is sufficient to compensate for thermal expansion differences.
Solution Approach 2:
The patent extracts the unnecessary complicating factor of compensating layers and other complex structural measures. By removing these extraneous elements and relying solely on temperature parameter control, the solution achieves deformation control with reduced device complexity.
3Ease of manufacture
If flat surfaces are used for thermal connection between semiconductor elements and heat sinks, then manufacturing is simple, but heat dissipation efficiency decreases under operating conditions
Solution Approach 1:
The patent applies curvature by forming a convex curvature on the surface of the semiconductor element that contacts the heat sink. This curved surface ensures continuous thermal contact under operating conditions, improving heat dissipation efficiency while maintaining manufacturing simplicity through a single curvature formation step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a nearly complete positive mechanical/thermal connection, ensuring reliable and efficient cooling of semiconductor elements, even under high heat dissipation conditions, while being low-effort and cost-effective to manufacture.
Implementation Method 1
These deformation processes therefore occur particularly during direct material-bonded joining under the influence of temperature, as is the case, for example, when soldering electrical flat assemblies, in contrast to the later operating temperature.
Data Source
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AI summary
The invention relates to a semiconductor assembly (1), comprising a semiconductor element (2) with first contacts (3), a carrier element (4) with second contacts (5), and a cooling body (6), wherein the first contacts (3), arranged on a first surface (7), facing toward the carrier element (4), of the semiconductor element (2), are electrically connected by means of electrically conductive material (8) to the second contacts (5) of the carrier element (4), wherein the semiconductor element (2) has, on a second surface (9) situated opposite the first surface (7), a convex curvature (10) with a first radius (11) or a concave curvature (12) with a second radius (13), wherein the semiconductor element (2) is, at the second surface (9) of the convex curvature (10), connected in positively locking fashion to a cooling body surface (14) of a concave cooling body curvature (15) of the cooling body (6) and, during operation at a selected barrier layer temperature (TJ), the first radius (11) of the convex curvature (10) deviates by at most 10% from a third radius (16) of the concave cooling body curvature (15), or wherein the semiconductor element (2) is, at the second surface (9) of the concave curvature (12), connected in positively locking fashion to a cooling body surface (14) of a convex cooling body curvature (17) of the cooling body (6) and, during operation at a selected barrier layer temperature (TJ), the second radius (13) of the concave curvature (12) deviates by at most 10% from a fourth radius (18) of the convex cooling body curvature (17). The invention furthermore relates to an inverter (19) having the semiconductor assembly (1) and to a production method (HV) for the cooling body (6) of the semiconductor assembly (1).