Semiconductor Package Cutting System with Integrated Inspection and Storage
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Solution Overview
Problem
Existing semiconductor package cutting systems require additional storage units for partial-cut semiconductor strips, increasing costs and equipment footprint.
Innovation Solution
A semiconductor package cutting system that integrates a cutting device, an inspection device, and a storage device, allowing for self-loading and unloading of materials without an additional storage unit, thereby enabling efficient partial-cutting of semiconductor packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an additional storage unit is used to store partial-cut semiconductor strips, then the partial-cutting process can be performed, but the cost and footprint of the equipment are increased
Solution Approach 1:
The patent combines the storage function with the existing inspection device by integrating a storage tray into the inspection device's structure. This allows the inspection device to serve dual purposes: inspecting semiconductor packages and storing partial-cut strips, thereby eliminating the need for a separate storage unit and reducing equipment footprint
Solution Approach 2:
The inspection device is designed to perform multiple functions: it inspects semiconductor packages for defects and simultaneously serves as a storage unit for partial-cut strips. This multi-functionality approach allows one device to replace what would traditionally require separate dedicated equipment, reducing overall system complexity and space requirements
2Adaptability or versatility
If an additional storage unit is used to store partial-cut semiconductor strips, then the partial-cutting process can be performed, but the cost of the process is increased
Solution Approach 1:
The patent merges the storage function with the inspection device, allowing the same hardware to serve both inspection and storage purposes. This eliminates the need to purchase and install separate storage equipment, thereby reducing capital expenditure and overall process cost
Solution Approach 2:
By designing the inspection device to perform both inspection and storage functions, the system reduces the total number of equipment pieces required. This multi-functionality approach lowers equipment acquisition costs, maintenance costs, and operational costs associated with running multiple separate devices
3Device complexity
If the inspection device moves the strip along a first direction, then self-loading and unloading can be performed without additional storage, but the strip must be properly positioned and oriented
Solution Approach 1:
The patent employs a vision system (camera and image processing) to automatically detect, recognize, and guide strip positioning. This optical/mechanical substitution replaces manual positioning operations, enabling the system to automatically determine strip orientation and adjust positioning accordingly, thereby maintaining ease of operation while reducing mechanical complexity
Data Source
AI summary
Provided is a semiconductor package cutting system including a cutting device for partial-cutting at least a portion of a strip including a plurality of semiconductor packages, an inspection device mounted behind the cutting device to supply a first strip to be cut to the cutting device and to receive and inspect a second strip cut by the cutting device, and a storage device mounted behind the inspection device to supply the first strip stored therein, to the inspection device and to receive and store the second strip inspected by the inspection device, wherein the inspection device includes an inspection table for placing the first or second strip thereon and moving the first strip along a first direction.